XC3S400-4FG320C

The XC3S400-4FG320C is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD, offered in a 320-ball BGA package. It provides a balanced combination of programmable logic, embedded memory, and I/O count for commercial embedded and digital logic designs.

With 8,064 logic elements, approximately 0.295 Mbits of on-chip RAM and 221 available I/O, this device is suited for designs that require medium-density logic integration and flexible I/O connectivity within a compact surface-mount package.

Key Features

• Programmable Logic  Provides 8,064 logic elements (approximate) to implement custom digital logic functions and state machines.
• Embedded Memory  Includes approximately 0.295 Mbits (294,912 bits) of on-chip RAM for buffering, lookup tables and small data storage tasks.
• I/O Capacity  Offers 221 I/O pins to support a variety of external interfaces and parallel/serial connectivity requirements.
• Logic Density  Rated at 400,000 gates to accommodate mid-range combinational and sequential logic requirements.
• Power Supply  Operates from a core supply range of 1.14 V to 1.26 V for the FPGA core domain.
• Package and Mounting  Supplied in a 320-BGA package (supplier device package: 320-FBGA, 19×19) optimized for surface-mount assembly.
• Commercial Grade Temperature  Specified for operation over a commercial temperature range of 0 °C to 85 °C.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Embedded Logic and Control  Use the FPGA to implement glue logic, protocol handlers, and control functions where 8,064 logic elements and on-chip RAM provide the necessary resources.
• Interface Bridging  Leverage 221 I/O pins to create custom parallel or serial interface bridges between subsystems in commercial electronic products.
• Prototyping and Proof-of-Concept  Employ the device for mid-density prototype designs that need reprogrammability and moderate gate density prior to production.

Unique Advantages

• Balanced Logic and Memory:  8,064 logic elements paired with approximately 0.295 Mbits of RAM enable mixed-control and data-path implementations without external memory for small buffers.
• Generous I/O Count:  221 I/O pins simplify board-level routing for designs requiring multiple interfaces or wide data buses.
• Compact BGA Footprint:  320-FBGA (19×19) packaging delivers a high-pin-count solution in a compact, surface-mount form factor to save PCB area.
• Commercial Temperature Range:  Specified 0 °C to 85 °C operation aligns with standard commercial product requirements.
• Regulatory Compliance:  RoHS compliance supports environmentally conscious manufacturing and assembly.

Why Choose XC3S400-4FG320C?

The XC3S400-4FG320C offers a practical mix of logic capacity, embedded memory and I/O resources in a compact 320-BGA package, making it well suited for commercial designs that require mid-range programmable logic and flexible connectivity. Its defined core voltage range and commercial temperature rating provide clear engineering constraints for system integration.

Choose this Spartan®-3 FPGA when you need reprogrammable logic with roughly 8,064 logic elements, approximately 0.295 Mbits of on-chip RAM, and up to 221 I/O in a surface-mount BGA footprint for robust, space-efficient designs supported by AMD documentation.

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