XC3S250E-5PQG208C

IC FPGA 158 I/O 208QFP
Part Description

Spartan®-3E Field Programmable Gate Array (FPGA) IC 158 221184 5508 208-BFQFP

Quantity 197 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O158Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs612Number of Logic Elements/Cells5508
Number of Gates250000ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of XC3S250E-5PQG208C – Spartan®-3E Field Programmable Gate Array (FPGA) IC 158 221184 5508 208-BFQFP

The XC3S250E-5PQG208C is a commercial-grade Spartan®-3E field programmable gate array from AMD. It provides a balance of logic capacity, embedded memory, and I/O density in a 208-pin BFQFP surface-mount package.

Designed for applications that require configurable logic and on-chip memory within a compact footprint, this FPGA offers 5,508 logic elements, approximately 0.22 Mbits of embedded memory, and 158 user I/O pins, with a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C operating range.

Key Features

  • Logic Capacity — 5,508 logic elements and 250,000 gates provide programmable resources for combinational and sequential logic designs.
  • Configurable Logic Blocks — 612 logic blocks suitable for partitioning designs across multiple functional regions.
  • Embedded Memory — Approximately 0.22 Mbits of on-chip RAM to support buffering, small data stores, and state machines without external memory.
  • I/O Density — 158 user I/O pins for interfacing with peripherals, buses, and external devices.
  • Power — Core voltage supply range of 1.14 V to 1.26 V to match system power rails and design requirements.
  • Package & Mounting — Surface-mount 208-BFQFP (supplier package: 208-PQFP, 28×28) for compact board layouts.
  • Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant, supporting lead-free assembly and regulatory requirements.

Unique Advantages

  • Balanced Logic and Memory: 5,508 logic elements paired with approximately 0.22 Mbits of embedded RAM lets you implement moderate-complexity functions without external memory.
  • High I/O Count: 158 I/O pins enable direct interfacing to multiple peripherals and parallel buses, reducing the need for external IO expanders.
  • Compact Surface-Mount Package: 208-BFQFP packaging supports space-constrained PCB designs while maintaining accessible pinout density.
  • Clear Power Envelope: Defined core supply range (1.14 V–1.26 V) simplifies power-supply selection and system integration.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation for standard commercial applications and environments.
  • Regulatory Readiness: RoHS compliance facilitates lead-free manufacturing and downstream regulatory alignment.

Why Choose XC3S250E-5PQG208C?

The XC3S250E-5PQG208C offers a practical combination of logic resources, embedded memory, and I/O capability in a compact 208-pin BFQFP footprint. Its specification set—5,508 logic elements, 158 I/Os, approximately 0.22 Mbits of on-chip RAM, and a clearly defined power and temperature window—makes it suitable for commercial electronic designs that require configurable logic with moderate resource needs.

Backed by AMD's Spartan®-3E family implementation, this device is intended for designers seeking a cost-conscious, RoHS-compliant FPGA solution that integrates into standard surface-mount assembly flows and commercial temperature environments.

Request a quote or submit your requirements to receive pricing and availability for the XC3S250E-5PQG208C. Our team will respond with up-to-date lead times and ordering information.

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