XC3S250E-4VQG100I

The XC3S250E-4VQG100I is a Spartan®-3E family Field Programmable Gate Array (FPGA) designed for mid-range digital integration. It provides a balance of logic capacity, embedded memory, and I/O counts for space-constrained surface-mount designs.

Targeted at industrial applications, this device delivers 5,508 logic elements, approximately 0.21 Mbits of on-chip RAM, and 66 user I/O pins in a 100-pin TQFP package, operating across a 1.14 V to 1.26 V supply range and an industrial temperature window.

Key Features

• Core Logic 5,508 logic elements and approximately 250,000 gates for implementing combinational and sequential digital functions.
• Embedded Memory Approximately 0.21 Mbits (221,184 bits) of on-chip RAM to support buffers, FIFOs, and small data stores without external memory.
• I/O Capacity 66 user I/O pins suitable for interfacing with peripherals, sensors, and buses in compact designs.
• Package & Mounting 100-pin TQFP surface-mount package (supplier device package listed as 100-VQFP, 14×14) for PCB space efficiency and standard assembly.
• Power Low-voltage core operation with a specified supply range of 1.14 V to 1.26 V to match modern low-voltage designs.
• Temperature & Grade Industrial grade operation across −40 °C to 100 °C for reliable performance in extended-temperature environments.
• Compliance RoHS-compliant construction to meet common environmental directives for lead-free manufacturing.

Typical Applications

• Embedded Control Implement custom control logic, state machines, and glue logic where ~5.5k logic elements and on-chip RAM are sufficient.
• Interface Bridging Handle protocol translation and I/O aggregation using 66 user I/Os in compact, surface-mount applications.
• Data Buffering and Small-Scale Signal Processing Use the on-chip RAM for buffering, FIFOs, or small data storage in signal-conditioning and preprocessing tasks.
• Industrial Electronics Deploy in industrial temperature environments that require robust operation from −40 °C to 100 °C.

Unique Advantages

• Balanced Logic and Memory: 5,508 logic elements paired with ≈0.21 Mbits of RAM provide a practical blend of resources for many mid-range FPGA tasks.
• Compact, Surface-Mount Package: The 100-pin TQFP footprint supports compact PCB layouts while keeping a generous I/O count.
• Industrial Temperature Range: Rated for −40 °C to 100 °C, enabling deployment in extended-temperature industrial environments.
• Low-Voltage Core Operation: A defined supply range of 1.14 V to 1.26 V supports integration with modern low-voltage power domains.
• RoHS Compliant: Meets common lead-free manufacturing requirements for environmental compliance.
• Proven Manufacturer: Produced by AMD, providing a recognizable supplier source for FPGA solutions.

Why Choose XC3S250E-4VQG100I?

The XC3S250E-4VQG100I positions itself as a practical mid-range FPGA option for designs that need a compact package, sensible logic capacity, and on-chip memory while operating across industrial temperatures. Its combination of 5,508 logic elements, approximately 0.21 Mbits of embedded RAM, and 66 user I/Os in a 100-pin TQFP package makes it well suited for embedded control, interface bridging, and small-scale signal processing tasks.

Designed and supplied by AMD, this device offers a straightforward specification set for engineers and procurement teams seeking a surface-mount FPGA with defined power and temperature characteristics and RoHS compliance for lead-free production.

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