XC3S250E-4VQG100C

IC FPGA 66 I/O 100VQFP
Part Description

Spartan®-3E Field Programmable Gate Array (FPGA) IC 66 221184 5508 100-TQFP

Quantity 1,893 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-TQFPNumber of I/O66Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs612Number of Logic Elements/Cells5508
Number of Gates250000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of XC3S250E-4VQG100C – Spartan®-3E Field Programmable Gate Array (FPGA) IC 66 221184 5508 100-TQFP

The XC3S250E-4VQG100C is an AMD Spartan-3E field programmable gate array (FPGA) supplied in a 100-pin TQFP package. It provides a compact, commercial-grade programmable logic solution with 612 CLBs and 5,508 logic elements, intended for designs that require on-chip logic, memory and I/O in a surface-mount footprint.

Key device attributes include approximately 221,184 bits of embedded RAM, 66 I/O pins, an estimated 250,000 gates of logic capacity, and a specified supply voltage range of 1.14 V to 1.26 V, with an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic  612 configurable logic blocks (CLBs) and 5,508 logic elements provide the programmable fabric for custom logic implementation.
  • Embedded Memory  Approximately 0.22 Mbits (221,184 bits) of on-chip RAM supports buffering, small FIFOs and state storage without external memory.
  • I/O Capacity  66 general-purpose I/O pins enable interfacing to peripherals, sensors and external logic in compact designs.
  • Logic Density  Approximately 250,000 gates of logic capacity suitable for mid-range programmable logic tasks.
  • Package and Mounting  100-pin TQFP (100‑VQFP, 14×14) surface-mount package for board-level integration in space-constrained applications.
  • Power  Device supply specified between 1.14 V and 1.26 V to match target power domains and regulator designs.
  • Commercial Temperature Range  Rated for 0 °C to 85 °C operation for commercial-grade applications.
  • RoHS Compliant  Meets RoHS requirements for lead-free assembly and compliance-driven designs.

Unique Advantages

  • Compact, surface-mount package: 100-TQFP footprint enables high-density PCB placement while keeping a conventional SMD assembly flow.
  • Balanced logic and memory: 5,508 logic elements paired with approximately 0.22 Mbits of embedded RAM supports mixed control and data-path functions on-chip.
  • Generous I/O count for the package: 66 I/Os provide flexible interfacing without increasing package pin count substantially.
  • Defined commercial-grade specification: Operates across 0 °C to 85 °C, aligning with standard commercial application requirements.
  • Predictable power domain: Narrow supply range (1.14 V–1.26 V) supports straightforward power supply design and integration.
  • RoHS compliance: Meets environmental regulations for lead-free manufacturing and global market acceptance.

Why Choose XC3S250E-4VQG100C?

The XC3S250E-4VQG100C delivers a practical mix of logic resources, embedded RAM and I/O in a 100-TQFP surface-mount package for commercial-grade FPGA designs. Its specification set—612 CLBs, 5,508 logic elements, approximately 221,184 bits of on-chip RAM, 66 I/Os and ~250,000 gates—makes it well suited to mid-range programmable logic tasks where board space and predictable electrical requirements matter.

Manufactured by AMD and supplied in a RoHS-compliant package, this Spartan-3E device offers a reliable building block for designers seeking a compact, commercially rated FPGA option with clearly defined electrical and thermal limits.

Request a quote or submit a parts availability inquiry to obtain pricing and lead-time information for the XC3S250E-4VQG100C.

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