XC3S250E-4VQ100I

The XC3S250E-4VQ100I is a Spartan®-3E field programmable gate array (FPGA) IC from AMD. It provides reconfigurable digital logic in a 100‑lead TQFP package, combining on-chip memory and a sizable logic resource for embedded and industrial designs.

Designed for surface-mount integration, this device targets applications that require programmable logic capacity along with industrial temperature operation and RoHS compliance.

Key Features

• FPGA Core Spartan®-3E architecture as identified by the part number, delivered in a surface-mount FPGA IC.
• Logic Capacity Approximately 5,508 logic elements and about 250,000 gates to implement custom digital functions.
• Embedded Memory Approximately 0.22 Mbits of on-chip RAM (221,184 total RAM bits) for buffering, state machines, and data storage.
• I/O and Package 66 general-purpose I/O pins in a 100‑TQFP package; supplier package listed as 100‑VQFP (14×14) for PCB footprint reference.
• Power Core supply range of 1.14 V to 1.26 V for the device core voltage domain.
• Temperature and Reliability Industrial grade device with operating temperature range from -40 °C to 100 °C and RoHS compliance.
• Mounting Surface mount package suitable for standard SMT assembly processes.

Typical Applications

• Industrial Control Programmable logic for control functions and custom interfaces, leveraging the device's industrial temperature rating.
• Embedded Systems On-chip RAM and 5,508 logic elements enable implementation of embedded peripherals, glue logic, and protocol handling.
• Interface and I/O Expansion 66 I/O pins provide flexible connectivity for sensor aggregation, bus bridging, and custom I/O functions.

Unique Advantages

• Compact, Deliverable Logic Capacity: 5,508 logic elements and ~250k gates provide substantial programmable resources in a small-footprint TQFP package.
• Integrated On‑Chip Memory: Approximately 0.22 Mbits of embedded RAM reduces the need for external memory in many designs.
• Industrial Temperature Support: Rated from -40 °C to 100 °C to meet temperature demands of industrial applications.
• Surface Mount Convenience: 100‑lead TQFP/VQFP packaging supports standard SMT assembly and compact board layouts.
• Regulatory Compliance: RoHS compliant construction supports restricted-substance requirements.

Why Choose XC3S250E-4VQ100I?

The XC3S250E-4VQ100I positions Spartan®-3E FPGA technology in a compact 100‑lead package, offering a balance of programmable logic, embedded memory, and I/O for industrial and embedded designs. Its combination of approximately 5,508 logic elements, ~0.22 Mbits of on-chip RAM, and a 66‑pin I/O complement makes it suitable for designs that require moderate logic density with flexible interfacing.

Engineers and procurement teams can rely on the device's industrial temperature rating, surface-mount package options, and RoHS compliance when specifying for production environments where long-term availability and robustness are considerations.

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