XC3S250E-4TQ144I

The XC3S250E-4TQ144I is a Spartan®-3E family Field Programmable Gate Array (FPGA) supplied in a 144-pin LQFP package. It provides a mid-density programmable logic resource set with on-chip embedded memory and a defined set of I/O for embedded and industrial applications.

Key attributes include 5,508 logic elements, approximately 0.22 Mbits of embedded memory, 108 I/O pins, and support for operation across an industrial temperature range, delivering a compact programmable platform for designs that require moderate logic density and reliable thermal performance.

Key Features

• Core Logic 5,508 logic elements (cells) supporting up to 250,000 equivalent gates for implementing custom digital logic and state machines.
• Embedded Memory Approximately 0.22 Mbits (221,184 bits) of on-chip RAM for buffering, FIFOs, and small data storage requirements.
• I/O Capacity 108 user I/O pins to interface with peripherals, sensors, and external devices.
• Power Nominal core supply range of 1.14 V to 1.26 V to match system power-rail requirements.
• Package and Mounting 144-pin LQFP package (supplier listing: 144-TQFP 20×20) with surface-mount mounting for compact PCB integration.
• Operating Range Industrial-grade temperature rating from −40 °C to 100 °C for deployment in temperature-critical environments.
• Environmental Compliance RoHS-compliant construction to meet environmental and manufacturing standards.

Typical Applications

• Industrial Control — Implement custom logic, control state machines, or I/O aggregation in systems requiring industrial temperature operation and up to 108 I/O connections.
• Embedded Processing — Provide mid-density programmable logic and on-chip RAM for glue logic, protocol bridging, and peripheral control in embedded platforms.
• Prototyping and Proof-of-Concept — Validate digital designs that require roughly 5,500 logic elements and modest on-chip memory before scaling to other devices.

Unique Advantages

• Mid-density programmable resource set: 5,508 logic elements and 250,000 equivalent gates enable meaningful logic integration without excessive board-level complexity.
• On-chip memory for localized buffering: Approximately 0.22 Mbits of embedded RAM reduces dependence on external memory for small data storage and FIFO use cases.
• Versatile I/O count: 108 user I/Os allow flexible interfacing to sensors, peripherals, and external logic while keeping a compact footprint.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in harsher thermal environments common in industrial equipment.
• Compact surface-mount LQFP package: 144-pin LQFP (144-TQFP 20×20) eases PCB routing and mechanical integration for space-constrained designs.
• RoHS compliant: Meets environmental standards for manufacturability and regulatory requirements.

Why Choose XC3S250E-4TQ144I?

The XC3S250E-4TQ144I combines a balanced set of programmable logic resources, embedded memory, and I/O capacity in a compact 144-pin surface-mount package with industrial temperature support. It is well suited to engineers and system designers who need a reliable, mid-density FPGA for embedded and industrial designs that demand controlled power rails and predictable thermal behavior.

With verifiable specifications for logic elements, on-chip RAM, I/O count, supply range, and temperature rating, this device offers a clear, specification-driven choice for projects that require scalable programmability and compliance with environmental standards.

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