XC3S250E-4TQ144C

The XC3S250E-4TQ144C is a Spartan®-3E field programmable gate array (FPGA) IC from AMD, delivered in a 144‑lead LQFP package. It provides up to 5,508 logic elements and multiple on-chip resources in a commercial-grade, surface-mount device.

This device is suited for designs that require a balance of logic capacity, on-chip memory, and I/O connectivity while operating within a standard commercial temperature range and low-voltage core supply.

Key Features

• Logic Capacity — 5,508 logic elements to implement combinational and sequential logic functions for mid-density designs.
• Embedded Memory — 221,184 bits of on-chip RAM, approximately 0.221 Mbits of embedded memory for data buffering and state storage.
• General-Purpose I/O — 108 available I/O pins to connect external peripherals, interfaces, and board-level signals.
• Gate Equivalent — Approximately 250,000 gates, providing a reference for device integration and partitioning.
• Power — Core voltage supply range of 1.14 V to 1.26 V for the device core.
• Package & Mounting — 144‑lead LQFP package; supplier device package listed as 144‑TQFP (20×20). Surface-mount design suitable for automated assembly.
• Operating Conditions — Commercial operating temperature range from 0 °C to 85 °C.
• Compliance — RoHS compliant, supporting lead‑free assembly and regulatory requirements.

Typical Applications

• Commercial digital logic — Implement medium-density logic functions where 5,508 logic elements and 108 I/O pins meet system requirements.
• On-chip buffering and state storage — Use the approximately 0.221 Mbits of embedded RAM for small FIFOs, buffering, and control-state memory.
• I/O-rich interface control — Leverage the 108 I/Os for board-level interfacing and peripheral connectivity in commercial-grade products.

Unique Advantages

• Balanced logic and memory footprint: Combines 5,508 logic elements with ~0.221 Mbits of embedded RAM to support a range of mid-density designs without external memory for small storage needs.
• Ample I/O count: 108 I/O pins simplify integration with multiple peripherals and interface standards on a single device.
• Compact, surface-mount package: 144‑lead LQFP (supplier: 144‑TQFP 20×20) enables automated PCB assembly and a compact board footprint.
• Low-voltage core: 1.14–1.26 V supply supports low-power core operation consistent with the device family.
• Commercial-grade availability: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.

Why Choose XC3S250E-4TQ144C?

The XC3S250E-4TQ144C delivers a pragmatic combination of logic capacity, embedded RAM, and I/O resources in a familiar 144‑lead surface-mount package from AMD. Its specification set targets commercial designs that require mid-density programmable logic with on-chip memory and a sizable I/O complement.

For engineers and procurement teams seeking a commercial-grade FPGA with clear, verifiable specifications — including core voltage range, operating temperature, package details, and RoHS compliance — this part provides a predictable platform for system integration and automated assembly.

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