XC3S400-4FGG320C

The XC3S400-4FGG320C is a Spartan®-3 series Field Programmable Gate Array (FPGA) in a 320-ball BGA package designed for commercial applications. It provides a mid-range combination of configurable logic, embedded RAM, and I/O density suitable for a variety of programmable digital designs.

Key architectural attributes include 8,064 logic elements, approximately 0.295 Mbits of on-chip RAM, and 221 user I/O pins, all within a 320-FBGA (19×19) surface-mount package. The device operates from a core supply range of 1.14 V to 1.26 V and is specified for 0 °C to 85 °C operation.

Key Features

• Core Logic  8,064 logic elements organized to implement custom digital logic and state machines; device listing also specifies 896 configurable logic block units.
• Embedded Memory  Approximately 0.295 Mbits (294,912 bits) of on-chip RAM for buffering, small frame storage, and local data structures.
• I/O Resources  221 user I/O pins to support parallel interfaces, control signals, and mix of input/output functions in a single package.
• Gate Equivalent  Rated at 400,000 gates, providing an indicative measure of logic capacity for mid-range designs.
• Power and Thermal  Core voltage supply range 1.14 V to 1.26 V; commercial operating temperature range from 0 °C to 85 °C.
• Package and Mounting  320-ball FBGA (19×19) package, surface-mount mounting type for compact board integration.
• Compliance  RoHS compliant, suitable for designs requiring lead-free component selection.

Typical Applications

• Commercial embedded systems — Implement custom control logic, glue-logic and peripheral interfaces in commercial electronic products.
• Prototyping and development — Reconfigurable hardware for validating logic, timing, and system-level functions early in development.
• Interface aggregation — Consolidate multiple parallel or serial I/O functions using the device’s 221 I/O pins and on-chip resources.

Unique Advantages

• Balanced logic and memory capacity: The combination of 8,064 logic elements and approximately 0.295 Mbits of embedded RAM supports mid-range digital implementations without immediate need for large external memories.
• High I/O density: 221 user I/Os enable integration of multiple peripherals and interfaces on a single device, reducing board complexity.
• Compact BGA footprint: 320-FBGA (19×19) package allows high-density board layouts while maintaining surface-mount assembly compatibility.
• Commercial-grade thermal range: Specified for 0 °C to 85 °C operation to match typical commercial product requirements.
• RoHS compliance: Meets lead-free manufacturing requirements for contemporary electronics production.

Why Choose XC3S400-4FGG320C?

The XC3S400-4FGG320C delivers a practical mix of logic elements, embedded RAM, and I/O resources in a compact 320-BGA package, making it well suited for engineers and OEMs developing mid-range commercial FPGA-based solutions. Its specified core voltage range and commercial temperature rating provide predictable integration into standard product designs.

For teams seeking a reprogrammable platform that balances capacity and board-level integration, this Spartan®-3 device offers a straightforward, verifiable option with RoHS compliance and a package geared for surface-mount assembly.

Request a quote or submit an inquiry to receive pricing and availability information for the XC3S400-4FGG320C. Sales and support can provide lead-time details and volume options to support your design cycle.