XC3S200-4TQ144C

IC FPGA 97 I/O 144TQFP
Part Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 97 221184 4320 144-LQFP

Quantity 857 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O97Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs480Number of Logic Elements/Cells4320
Number of Gates200000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of XC3S200-4TQ144C – Spartan®-3 FPGA, 4,320 logic elements, 144-LQFP

The XC3S200-4TQ144C is a Spartan®-3 field programmable gate array (FPGA) in a 144-pin LQFP surface-mount package. It combines 4,320 logic elements with approximately 0.22 Mbits of embedded memory, offering a compact, low-voltage solution for designs that require moderate logic density, on-chip RAM, and a sizable I/O count.

Key device attributes include a 97-pin I/O capability, a 1.14 V to 1.26 V core supply range, RoHS compliance, and commercial operating temperature support from 0 °C to 85 °C.

Key Features

  • Core Logic  Provides 4,320 logic elements and 480 CLBs to implement a broad range of digital functions within a single FPGA fabric.
  • Embedded Memory  Approximately 0.22 Mbits of on-chip RAM (221,184 total RAM bits) for buffering, state storage, and small lookup tables.
  • I/O Capability  97 user I/O pins to support multiple interfaces and peripheral connections directly from the FPGA package.
  • Gate Capacity  Equivalent to approximately 200,000 gates for combinational and sequential logic implementations.
  • Power  Core voltage supply specified between 1.14 V and 1.26 V for integration into designs with low-voltage FPGA cores.
  • Package & Mounting  144-LQFP surface-mount package (supplier device package listed as 144-TQFP, 20×20) for compact PCB layouts and standard assembly processes.
  • Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

  • Balanced Logic and Memory: 4,320 logic elements paired with ~0.22 Mbits of embedded RAM provides a practical mix for mid-density designs without external memory support.
  • Generous I/O Count: 97 I/O pins allow flexible interfacing to sensors, controllers, and peripheral devices within a single package.
  • Compact Surface-Mount Package: 144-pin LQFP offers a compact footprint for space-constrained PCBs while supporting conventional SMT assembly.
  • Low-Voltage Core: A tightly specified core supply range (1.14 V–1.26 V) simplifies power-supply planning for low-voltage systems.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C operation, suitable for a wide range of non-industrial environments.
  • Standards-Friendly: RoHS compliance supports environmental and manufacturing requirements for modern electronics production.

Why Choose XC3S200-4TQ144C?

The XC3S200-4TQ144C positions itself as a compact, mid-density FPGA choice for designs that need a balance of logic resources, embedded memory, and I/O in a standard surface-mount package. Its specified core voltage range and commercial temperature rating make it appropriate for many consumer and commercial electronics applications that operate within those limits.

Engineers and procurement teams will find the XC3S200-4TQ144C a practical option when looking to consolidate logic, reduce external component count, and maintain a small PCB footprint while retaining on-chip RAM and ample I/O connectivity.

Request a quote or submit your requirements to obtain availability and pricing for the XC3S200-4TQ144C.

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