XC3S200-4PQG208I

The XC3S200-4PQG208I is an AMD Spartan®-3 field programmable gate array supplied in a 208-BFQFP surface-mount package. It integrates 480 CLBs and 4,320 logic elements with approximately 0.22 Mbits of on-chip RAM, supporting designs that require moderate logic density, embedded memory and substantial I/O connectivity.

Targeted for industrial applications, this device features 141 I/O pins, an operating temperature range of −40 °C to 100 °C and a narrow core supply range of 1.14 V to 1.26 V, making it suitable for systems that need deterministic I/O, integrated logic and compact board mounting.

Key Features

• Core Logic  480 CLBs delivering 4,320 logic elements for implementing custom logic, state machines and glue logic.
• Embedded Memory  Total on-chip RAM of 221,184 bits (approximately 0.22 Mbits) for buffering, small FIFOs and local storage.
• I/O Capacity  141 user I/O pins for parallel interfaces, control signals and peripheral connectivity.
• Gate Count  200,000 gates for estimating design scale and partitioning between logic and routing resources.
• Power  Core voltage supply range of 1.14 V to 1.26 V for designs targeting a defined low-voltage power domain.
• Package & Mounting  208-BFQFP package supplied as 208-PQFP (28x28) and designed for surface-mount assembly to support compact board layouts.
• Operating Range  Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenged environments.
• Compliance  RoHS-compliant to support regulatory requirements for lead-free designs.

Typical Applications

• Industrial Control  Implement motor control logic, sequencing and I/O aggregation where industrial temperature range and 141 I/O pins are required.
• Embedded Systems  Provide glue logic, custom peripherals and buffering using 4,320 logic elements and on-chip RAM in compact surface-mount modules.
• Communications & Interface Bridging  Realize parallel interface bridging, protocol adaptation and I/O expansion leveraging the device’s gate count and high I/O density.
• Test & Measurement  Use on-chip memory and configurable logic for data acquisition front-ends, signal conditioning control and deterministic timing functions.

Unique Advantages

• Integrated Logic and Memory: Combines 4,320 logic elements with approximately 0.22 Mbits of embedded RAM to reduce external component count and simplify design.
• Substantial I/O Count: 141 I/O pins enable direct connection to multiple peripherals and parallel interfaces without large external I/O expanders.
• Industrial Temperature Rating: Rated from −40 °C to 100 °C to meet the needs of rugged and temperature-variable deployments.
• Compact Surface-Mount Package: 208-BFQFP (208-PQFP (28x28)) supports dense PCB layouts and automated assembly processes.
• Low-Voltage Core: A defined core supply range of 1.14 V to 1.26 V aids power budgeting and integration into low-voltage system domains.
• RoHS Compliance: Meets lead-free requirements for environmentally conscious manufacturing and regulatory compliance.

Why Choose XC3S200-4PQG208I?

The XC3S200-4PQG208I positions itself as a compact, industrial-grade Spartan-3 FPGA option that balances logic capacity, embedded memory and I/O density in a surface-mount 208-BFQFP package. Its specified operating temperature range and RoHS compliance make it appropriate for long-life industrial and embedded projects requiring dependable operation across environmental extremes.

This device is well suited for engineers and procurement teams designing systems that need predictable low-voltage core operation, a moderate gate count and a high number of I/O pins while keeping PCB footprint and component count under control.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the XC3S200-4PQG208I and to discuss how it fits your design requirements.