XC3S200-4FTG256I

The XC3S200-4FTG256I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD, offered in a 256-LBGA package. It provides a mid-density programmable logic resource with a balance of logic elements, embedded memory, and I/O capability tailored for industrial-grade embedded applications.

With 4,320 logic elements, approximately 0.22 Mbits of on-chip RAM, 173 I/O pins, and a specified operating range of 1.14 V to 1.26 V and −40 °C to 100 °C, this device targets designs that need moderate logic capacity, on-chip memory, and wide temperature tolerance in a compact surface-mount package.

Key Features

• Core Logic  4,320 logic elements and 480 CLBs provide mid-density programmable logic resources for adaptable digital designs.
• Embedded Memory  Approximately 0.22 Mbits (221,184 bits) of on-chip RAM to support buffers, state machines, and small data storage without external memory.
• I/O Capability  173 I/O pins enable connectivity to a wide range of peripherals and parallel interfaces directly from the FPGA fabric.
• Gate Equivalent  Approximately 200,000 gates for implementing combinational and sequential logic functions within the device.
• Power  Specified core supply voltage range from 1.14 V to 1.26 V for system-level power planning and regulator selection.
• Package & Mounting  256-LBGA package (supplier device package: 256-FTBGA, 17×17) in a surface-mount form factor for compact board-level integration.
• Temperature Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suited for thermally demanding environments.
• Compliance  RoHS-compliant to support lead-free manufacturing processes.

Typical Applications

• Industrial Control  Suitable for programmable control logic and interface tasks where industrial temperature range and reliable I/O density are required.
• Embedded Systems  Fits mid-density embedded designs that benefit from on-chip RAM and a substantial number of I/O pins for peripheral integration.
• Custom Interface and Glue Logic  Useful for implementing protocol bridges, custom interfaces, and board-level glue logic using the available logic elements and I/O resources.
• Prototyping and Functional Validation  Offers a compact FPGA option for proof-of-concept designs and hardware validation where moderate logic capacity and industrial temperature support are needed.

Unique Advantages

• Balanced Logic & Memory: 4,320 logic elements paired with approximately 0.22 Mbits of embedded RAM allow implementation of a variety of mid-complexity functions without external memory.
• Generous I/O Count: 173 I/O pins enable flexible connections to multiple peripherals, sensors, and interfaces, reducing the need for external multiplexer circuitry.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in temperature-challenging environments common in industrial applications.
• Compact, Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) delivers a space-efficient footprint for dense PCB layouts while supporting conventional surface-mount assembly.
• Controlled Power Envelope: Narrow core voltage range (1.14 V to 1.26 V) simplifies power-supply selection and thermal planning for embedded systems.
• RoHS Compliance: Compliance helps meet lead-free manufacturing and environmental requirements.

Why Choose XC3S200-4FTG256I?

The XC3S200-4FTG256I delivers a purposeful blend of mid-range programmable logic, embedded memory, and substantial I/O capacity in a compact 256-LBGA surface-mount package. Its industrial temperature rating and defined core voltage range make it a practical choice for embedded and industrial designs that require reliable operation across a broad temperature span.

Produced by AMD and offered as an industrial-grade Spartan®-3 FPGA, this device is suited for engineers seeking a cost-effective, mid-density programmable solution that supports on-chip memory needs and flexible I/O integration while maintaining a compact PCB footprint.

Request a quote or submit an inquiry to check availability and pricing for the XC3S200-4FTG256I and to discuss how it can fit into your next design.