XC3S200-4PQG208C

The XC3S200-4PQG208C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD supplied in a 208-BFQFP surface-mount package. It provides a moderate logic capacity with on-chip memory and a substantial number of I/O pins for custom digital designs.

With 4,320 logic elements, approximately 221,184 bits of embedded RAM, and 141 I/O lines, this commercial-grade FPGA is suited for designs that require flexible programmable logic, local memory, and extensive interfacing within a 208-pin PQFP footprint.

Key Features

• Logic Capacity — 4,320 logic elements supporting up to approximately 200,000 gates for implementing custom digital logic and control functions.
• Embedded Memory — Approximately 0.22 Mbits (221,184 bits) of on-chip RAM for buffering, small data storage, and state machine implementation.
• I/O Resources — 141 user I/O pins to support multiple interfaces, peripherals, and external device connections.
• Package & Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) with surface-mount mounting for compact board-level integration.
• Power — Core supply range from 1.14 V to 1.26 V to match system power requirements.
• Operating Range & Grade — Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Custom digital logic and prototyping — Implement state machines, glue logic, and custom accelerators using the device’s 4,320 logic elements and on-chip RAM.
• Embedded control and peripheral interfacing — Use the 141 I/O pins to connect sensors, actuators, and peripheral devices in embedded systems.
• Interface bridging and glue functions — Translate and route signals between subsystems or legacy interfaces where programmable logic and moderate memory are required.

Unique Advantages

• Balanced logic and memory mix: 4,320 logic elements combined with approximately 0.22 Mbits of embedded RAM allow compact implementations of control logic with local data storage.
• High I/O count: 141 I/O pins enable flexible board-level connectivity without external expander components.
• Compact PQFP footprint: 208-pin BFQFP package provides a high-pin-count solution in a surface-mount form factor for space-constrained PCBs.
• Clear supply and thermal parameters: Defined core voltage range (1.14 V–1.26 V) and commercial operating temperature (0 °C–85 °C) simplify system power and thermal planning.
• Regulatory compliance: RoHS compliance supports environmentally conscious assembly and procurement.

Why Choose XC3S200-4PQG208C?

The XC3S200-4PQG208C offers a practical balance of logic density, on-chip memory, and a high I/O count in a 208-pin PQFP package, making it suitable for designs that need programmable logic, local buffering, and extensive external connectivity. Its commercial-grade temperature rating and defined supply range make it straightforward to integrate into standard embedded and interface-focused applications.

Manufactured by AMD, this Spartan®-3 FPGA is a fit for engineers and procurement teams looking for a mid-range programmable device with clear, verifiable specifications for logic capacity, memory, I/O, and packaging.

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