XC3S200-4FT256I

The XC3S200-4FT256I is a Spartan®-3 field programmable gate array (FPGA) manufactured by AMD, offering 4,320 logic elements and approximately 0.22 Mbits of embedded memory. Its combination of mid-range logic capacity, on-chip RAM and a 173-pin I/O count provides a compact, industrial-grade programmable logic option for embedded and industrial system designs.

With a 256-LBGA / 256-FTBGA (17×17) package and a specified operating range of −40°C to 100°C, this device is targeted at applications that require surface-mount integration, controlled power supply requirements, and RoHS compliance.

Key Features

• Core Logic  Provides 4,320 logic elements and an effective gate equivalence of 200,000 gates for implementing custom digital functions and control logic.
• On‑Chip Memory  Includes 221,184 total RAM bits — approximately 0.22 Mbits — for embedded buffering, small lookup tables, and state storage.
• I/O Capacity  Offers 173 user I/Os to support a wide range of peripheral and bus interfacing requirements.
• Package and Mounting  Supplied in a 256-LBGA package; supplier device package listed as 256-FTBGA (17×17), and designed for surface-mount assembly.
• Power  Operates from a core voltage supply specified between 1.14 V and 1.26 V, enabling predictable power budgeting in system designs.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C, suitable for many industrial environments.
• Environmental Compliance  RoHS compliant for regulatory and end-product requirements.

Unique Advantages

• Balanced mid-range capacity: 4,320 logic elements and 200,000 equivalent gates provide a practical balance of resources for control, glue-logic and modest signal-processing tasks without excessive board area.
• On-chip buffering: Approximately 0.22 Mbits of embedded RAM reduces dependency on external memory for small data storage and state machines.
• Generous I/O count: 173 I/Os allow multiple interfaces and peripheral connections from a single device, simplifying system partitioning.
• Industrial-grade operation: Specified −40°C to 100°C performance and RoHS compliance make it suitable for many industrial deployments requiring regulatory adherence.
• Compact, assembly-friendly package: 256-LBGA / 256-FTBGA (17×17) supports high-density board designs and surface-mount manufacturing flows.
• Predictable power envelope: Narrow core voltage range (1.14 V to 1.26 V) helps with precise power-supply design and thermal planning.

Why Choose XC3S200-4FT256I?

The XC3S200-4FT256I positions itself as a reliable, industrial-grade Spartan®-3 FPGA option for designers needing a mid-range programmable logic device with solid integration of logic, memory and I/O. Its combination of 4,320 logic elements, approximately 0.22 Mbits of embedded RAM and 173 I/Os supports compact system designs where board space, thermal range and RoHS compliance are important.

This device is well suited to engineers and procurement teams looking for a predictable, surface-mount FPGA solution that balances resource capacity, package density and industrial operating range. The clear electrical and mechanical specifications simplify system-level integration and long-term supply planning.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S200-4FT256I and to discuss how it can fit into your next industrial or embedded design.