XC3S1600E-5FGG400C

The XC3S1600E-5FGG400C is a Spartan®-3E FPGA from AMD, delivered in a 400-ball BGA package and designed for surface-mount board integration. It provides a mid-range combination of logic capacity, on-chip memory and I/O count for commercial-temperature applications.

This device combines 33,192 logic elements with approximately 0.664 Mbits of embedded memory and 304 general-purpose I/O, making it suitable for designs that require moderate logic density, substantial I/O connectivity, and a compact BGA footprint.

Key Features

• Logic Capacity — 33,192 logic elements supporting up to 1,600,000 gates for implementing custom digital logic and moderate-complexity functions.
• Embedded Memory — Approximately 0.664 Mbits of on-chip RAM for buffering, FIFOs and local data storage without external memory.
• I/O Resources — 304 user I/O pins to accommodate multiple peripheral interfaces and sensor/actuator connections.
• Power — Device voltage supply specified from 1.14 V to 1.26 V to meet core power requirements.
• Package & Mounting — 400-BGA (supplier package: 400-FBGA, 21×21) in a surface-mount format for high-density PCB designs.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard environmental conditions.
• Regulatory — RoHS compliant.

Typical Applications

• Digital Logic Prototyping — Use the 33,192 logic elements and approximately 0.664 Mbits of embedded memory to prototype and validate custom digital architectures.
• I/O-Intensive Interfaces — 304 I/O pins enable interfacing with numerous peripherals, sensors, and external controllers in board-level systems.
• Compact Board Integration — The 400-BGA surface-mount package supports space-constrained PCB layouts while maintaining significant on-chip resources.
• Power-Constrained Designs — Operates within a 1.14 V to 1.26 V supply range to fit designs with defined core-voltage domains.

Unique Advantages

• Balanced Logic and Memory — 33,192 logic elements paired with approximately 0.664 Mbits of embedded RAM provide a practical balance for mid-range FPGA tasks without immediate need for external memory.
• High I/O Count — 304 I/O pins reduce the need for external multiplexing, simplifying board-level connectivity and lowering BOM complexity.
• Compact BGA Footprint — 400-FBGA (21×21) package enables dense PCB integration for compact systems.
• Commercial Temperature Rating — Rated 0 °C to 85 °C for deployments in standard commercial environments.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing processes.
• Manufacturer Support — Supplied by AMD, offering established manufacturing traceability for procurement and production planning.

Why Choose XC3S1600E-5FGG400C?

The XC3S1600E-5FGG400C positions itself as a commercial-grade, mid-range Spartan®-3E FPGA that delivers a practical mix of logic density, embedded memory and extensive I/O in a compact BGA package. Its specification set is well suited to engineers and procurement teams seeking a surface-mount FPGA for board-level designs that require moderate integration without expanding to larger devices.

With explicit supply voltage and temperature ratings, RoHS compliance, and AMD manufacturing, this part supports predictable integration into commercial products and prototypes where on-chip resources and I/O capacity are key selection criteria.

Request a quote or submit a quotation request to obtain pricing and availability for XC3S1600E-5FGG400C for your next design or production run.