XC3S1600E-4FGG400I

The XC3S1600E-4FGG400I is an AMD Spartan®-3E field programmable gate array (FPGA) supplied in a 400‑ball FBGA package. It combines a high logic element count with on‑chip memory and a broad I/O complement suitable for industrial-grade programmable logic applications.

Key attributes include 33,192 logic elements (implemented across 3,688 CLBs), approximately 0.66 Mbits of embedded RAM, 304 I/O pins, and support for low-voltage core operation between 1.14 V and 1.26 V. The device is RoHS compliant and rated for operation from -40 °C to 100 °C.

Key Features

• Core Logic  3,688 configurable CLBs providing 33,192 logic elements to implement complex digital functions and custom logic blocks.
• Embedded Memory  Approximately 0.66 Mbits of on‑chip RAM for buffering, state storage, and small lookup tables.
• I/O Capacity  304 user I/O pins to support multiple parallel interfaces and system interconnects.
• Logic Density  Equivalent to 1,600,000 gates, enabling medium-to-high density logic designs.
• Package & Mounting  400‑ball FBGA (21 × 21) package, surface mount for compact PCB integration.
• Power  Low-voltage core supply range of 1.14 V to 1.26 V for the programmable logic core.
• Temperature & Grade  Industrial grade with an operating range of -40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant to meet lead‑free assembly requirements.

Typical Applications

• Industrial Systems  Industrial deployments that require an industrial temperature rating and substantial I/O for control and monitoring functions.
• High‑Density Logic Designs  Designs that need tens of thousands of logic elements and significant gate count for custom digital signal processing or control logic.
• On‑Chip Memory Buffering  Use cases that leverage approximately 0.66 Mbits of embedded RAM for data buffering, small FIFO implementations, or state storage.

Unique Advantages

• High Logic Capacity: 33,192 logic elements across 3,688 CLBs allow implementation of sizeable custom logic without external gate arrays.
• Substantial I/O Count: 304 I/O pins reduce the need for external I/O expanders and simplify board-level routing for multi‑interface systems.
• Compact BGA Packaging: 400‑ball FBGA (21 × 21) delivers a dense footprint for space-constrained PCBs while supporting surface-mount assembly.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to support deployment in harsh or temperature-variable environments.
• Low‑Voltage Core Operation: Core supply between 1.14 V and 1.26 V aligns with modern low-voltage system architectures to minimize power draw at the logic core.
• RoHS Compliance: Meets lead‑free manufacturing requirements for regulatory and assembly compatibility.

Why Choose XC3S1600E-4FGG400I?

The XC3S1600E-4FGG400I positions itself as an industrial‑grade, mid‑to‑high density FPGA with a strong balance of logic resources, on‑chip memory, and I/O capacity in a compact 400‑ball FBGA package. Its combination of 33,192 logic elements, roughly 0.66 Mbits of embedded RAM, and 304 I/Os make it suitable for designs that require significant programmable logic and local memory while operating across a wide temperature range.

This device is appropriate for engineering teams and procurement looking for a reliable, RoHS‑compliant FPGA offering deterministic logic capacity and I/O flexibility. Its package and supply voltage characteristics support integration into modern surface‑mount systems where board space and low‑voltage operation are considerations.

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