XC3S1600E-4FG484I

The XC3S1600E-4FG484I is a Spartan®-3E Field Programmable Gate Array (FPGA) from AMD, provided in a 484-ball BGA package. It combines a high count of logic elements and on-chip memory with a large I/O complement and industrial operating range to support configurable digital logic implementations.

Designed for applications that require significant programmable logic density and flexible I/O, this device offers a balance of integration and robustness for industrial deployments and complex system designs.

Key Features

• Logic Capacity  33,192 logic elements and 3,688 CLB blocks provide substantial programmable logic resources to implement complex digital functions and custom accelerators.
• On-Chip Memory  Approximately 0.664 Mbits (663,552 bits) of embedded RAM for local buffering, state storage, and intermediate data handling within custom logic.
• I/O and Gate Count  376 user I/O pins and approximately 1,600,000 gates enable broad connectivity and support for dense logic implementations and interface integration.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power design requirements.
• Package and Mounting  484-ball BGA package (supplier device package listed as 484-FBGA (23x23)) with surface-mount construction for compact board-level integration.
• Industrial Grade and Temperature Range  Industrial grade device with an operating temperature range from -40 °C to 100 °C suitable for demanding ambient environments.
• Regulatory Compliance  RoHS compliant to support environmentally conscious manufacturing and end-product requirements.

Typical Applications

• Industrial control and automation — The industrial grade rating and -40 °C to 100 °C operating range, together with 376 I/Os, support deployment in automation systems requiring robust, configurable logic.
• Communications and interface bridging — High I/O count and substantial logic capacity enable protocol adaptation, interface aggregation, and custom packet handling functions.
• System prototyping and custom logic integration — 33,192 logic elements and on-chip RAM make the device suitable for prototyping and integrating custom digital functions before committing to fixed silicon.

Unique Advantages

• High programmable density: 33,192 logic elements allow consolidation of multiple functions into a single device, reducing BOM and board complexity.
• Embedded memory for local data handling: Approximately 0.664 Mbits of on-chip RAM supports buffering and temporary storage without external memory.
• Extensive I/O capability: 376 user I/Os facilitate connectivity to multiple peripherals, sensors, and high-pin-count interfaces.
• Industrial operating range: Rated for -40 °C to 100 °C, enabling reliable operation in challenging ambient conditions.
• Compact BGA footprint: 484-ball BGA (supplier package listed as 484-FBGA (23x23)) provides a space-efficient solution for dense board designs.
• Environmentally compliant: RoHS compliance supports regulatory and sustainability requirements for modern products.

Why Choose XC3S1600E-4FG484I?

The XC3S1600E-4FG484I delivers a balanced combination of logic capacity, on-chip memory, and extensive I/O in an industrial-grade FPGA package from AMD’s Spartan®-3E family. Its specifications make it suitable for engineers seeking a configurable, robust building block for complex digital designs that must operate across a wide temperature range.

This device is well suited to teams developing industrial control systems, communications interfaces, and multi-function prototypes that require a reliable, programmable platform with substantial embedded resources and environmental compliance.

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