XC3S1600E-4FG400I

The XC3S1600E-4FG400I is a Spartan®-3E field programmable gate array (FPGA) manufactured by AMD, supplied in a 400-ball BGA package (400-FBGA, 21×21). This industrial-grade, surface-mount FPGA provides a balance of programmable logic, on-chip memory and I/O density for embedded and industrial applications.

With a core supply range of 1.14 V to 1.26 V and an operating temperature range from −40 °C to 100 °C, the device is specified for environments requiring extended temperature tolerance and RoHS-compliant manufacturing.

Key Features

• Programmable Logic: 33,192 logic elements and 3,688 CLBs provide substantial capacity for complex digital designs and custom logic implementation.
• Embedded Memory: Approximately 0.66 Mbits (663,552 bits) of on-chip RAM to support buffering, state storage and small data tables on-chip.
• I/O Density: 304 user I/O pins delivered from the 400-BGA package enable multiple external interfaces and flexible board-level integration.
• Logic Scale: Documented 1,600,000 gates for designers evaluating overall gate-equivalent complexity and partitioning.
• Package & Mounting: 400-BGA (400-FBGA, 21×21) surface-mount package suitable for compact PCB layouts where BGA mounting is required.
• Power & Voltage: Core supply specified between 1.14 V and 1.26 V for consistent power planning and supply design.
• Temperature Range: Industrial operating range from −40 °C to 100 °C for temperature-demanding deployments.
• Environmental Compliance: RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• Industrial Control: Implement custom control logic and sequencing in industrial automation systems where extended temperature operation is required.
• Embedded Systems: Integrate programmable logic, on-chip memory and abundant I/O for mid-range embedded designs.
• Communication Interfaces: Provide parallel and serial I/O support for custom interface bridging and protocol handling within constrained PCB footprints.

Unique Advantages

• Substantial Logic Capacity: 33,192 logic elements enable implementation of sizable custom logic blocks without immediate need for higher-tier devices.
• On-Chip Memory: Approximately 0.66 Mbits of embedded RAM reduces external memory dependence for buffering and state storage.
• High I/O Count: 304 I/Os facilitate multiple peripheral and interface connections from a single FPGA package.
• Industrial Temperature Suitability: Rated from −40 °C to 100 °C to support deployments in thermally demanding environments.
• Compact BGA Integration: 400-FBGA (21×21) package supports dense board layouts and high pin-count integration in surface-mount assemblies.
• Standards-Friendly Compliance: RoHS compliance supports lead-free manufacturing processes and regulatory requirements.

Why Choose XC3S1600E-4FG400I?

The XC3S1600E-4FG400I delivers a balanced combination of programmable logic density, embedded memory and I/O resources in a compact 400-BGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for designers targeting industrial and embedded applications that require reliable operation across a wide temperature range.

Manufactured by AMD, this Spartan®-3E FPGA suits projects that need mid-range gate and logic element capacity with integrated memory and strong I/O capability, offering a clear option for designs seeking on-chip integration and durable operating characteristics.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S1600E-4FG400I for your next design.