XC3S1500L-4FGG676C

The XC3S1500L-4FGG676C is an AMD Spartan®-3L Field Programmable Gate Array (FPGA) in a 676-ball FBGA (27×27) package. It delivers a mid-range integration point with 2,816 CLBs and 29,952 logic elements to support complex combinational and sequential logic implementations.

With approximately 0.59 Mbits of embedded memory, roughly 1,500,000 gates, and 487 user I/O pins, this surface-mount commercial-grade device is intended for designs that require substantial logic density, abundant I/O, and low-voltage core operation (1.14–1.26 V).

Key Features

• FPGA Core and Logic 2,816 CLBs providing 29,952 logic elements and an estimated 1,500,000 gates for implementing medium to large digital functions.
• Embedded Memory Approximately 0.59 Mbits of on-chip RAM for buffering, state storage, and local data handling.
• I/O Capacity 487 user I/O pins to support multiple interfaces, parallel buses, and high-pin-count system integration.
• Power Core supply voltage range of 1.14 V to 1.26 V to match low-voltage system requirements.
• Package and Mounting 676-FBGA (27×27) package, surface-mount, suitable for compact board layouts requiring a high-density FPGA footprint.
• Operating Range and Grade Commercial-grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant for environmental compliance.

Typical Applications

• System Glue Logic and Control Use the available logic elements and CLBs to implement custom control, protocol adaptation, and peripheral interfacing in complex systems.
• High I/O Interface Hubs The 487 I/O pins support designs that need numerous parallel or serial interfaces and dense connectivity to peripherals or daughter cards.
• Embedded Memory-Dependent Functions Approximately 0.59 Mbits of embedded RAM enables on-chip buffering, FIFOs, and local data storage for timing-critical operations.

Unique Advantages

• Significant Logic Density: Nearly 30k logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Extensive I/O Resources: 487 I/Os provide flexibility for dense interface requirements without external I/O expanders.
• Integrated Embedded RAM: On-chip memory simplifies designs that need local buffering or state storage while minimizing external memory dependencies.
• Compact BGA Footprint: The 676-ball FBGA (27×27) package supports high pin-count routing in a compact area for space-constrained PCBs.
• RoHS Compliant Commercial Device: RoHS compliance and a 0 °C to 85 °C operating temperature range align with standard commercial production and deployment environments.

Why Choose XC3S1500L-4FGG676C?

The XC3S1500L-4FGG676C from AMD's Spartan®-3L family offers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 676-FBGA package. Its commercial-grade rating and RoHS compliance make it suitable for production designs that require substantial on-chip resources while operating within standard temperature and supply constraints.

This device is a practical choice for engineering teams looking to consolidate mid-range digital functions, implement high-pin-count interfaces, and leverage on-chip RAM to reduce external component needs—providing a focused platform for scalable system designs.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the XC3S1500L-4FGG676C.