XC3S1600E-4FG484C

The XC3S1600E-4FG484C is a Spartan®-3E field programmable gate array (FPGA) manufactured by AMD. It provides a programmable logic fabric with 33,192 logic elements and embedded memory suitable for commercial embedded designs requiring high I/O density and on-chip resources.

Packaged in a 484-BBGA (484-FBGA, 23×23) surface-mount package and rated for commercial temperature operation, this device targets applications where integration of custom logic, significant I/O, and compact packaging are priorities.

Key Features

• Logic Capacity  Approximately 33,192 logic elements for implementing complex programmable logic and custom datapaths.
• Embedded Memory  Approximately 0.664 Mbits of on-chip RAM to support buffers, FIFOs, and temporary storage for logic operations.
• I/O Density  376 general-purpose I/O pins to interface with multiple peripherals, buses, and external devices.
• Gate Count  About 1,600,000 gates of total logic resource, providing substantial combinational and sequential capability.
• Package and Mounting  484-BBGA (supplier device package: 484-FBGA, 23×23) in a surface-mount form factor for space-constrained PCBs.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match target system power rails and regulators.
• Operating Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant, meeting common lead-free environmental requirements.

Typical Applications

• Commercial Embedded Systems  Use the FPGA to integrate custom control logic and I/O routing in commercial devices that require a high number of interfaces and programmable functionality.
• Consumer and Enterprise Electronics  Implement user interface control, protocol bridging, and peripheral aggregation where compact BGA packaging and high I/O count are advantageous.
• Prototyping and Development Platforms  Leverage the available logic elements and on-chip memory to prototype digital designs and validate custom logic implementations in a commercial-temperature environment.

Unique Advantages

• High Logic Density:  33,192 logic elements enable substantial on-chip programmability for complex designs without immediate need for additional ASIC development.
• Significant On-Chip Memory:  Approximately 0.664 Mbits of embedded RAM allows local buffering and temporary storage to streamline data paths and reduce external memory dependence.
• Extensive I/O Count:  376 I/O pins support multiple interfaces and peripherals, reducing the need for external multiplexing or additional interface chips.
• Compact BGA Footprint:  484-BBGA surface-mount package delivers a high-pin-count solution in a compact board area for space-sensitive applications.
• Controlled Power Range:  Specified core voltage range (1.14 V–1.26 V) simplifies power rail planning for reliable operation.
• RoHS Compliant:  Meets lead-free environmental requirements for easier integration into commercial product supply chains.

Why Choose XC3S1600E-4FG484C?

The XC3S1600E-4FG484C combines a substantial programmable logic resource (33,192 logic elements), approximately 0.664 Mbits of embedded memory, and a 376-pin I/O count in a compact 484-BBGA surface-mount package—making it well suited to commercial embedded designs that require integration of custom logic and multiple interfaces. Its specified core voltage range and commercial temperature rating align with typical commercial system requirements.

Manufactured by AMD, this Spartan®-3E FPGA offers a pragmatic balance of integration, I/O capability, and on-chip memory for OEMs and developers building commercial products or development platforms that need flexible, programmable logic in a space-efficient package.

Request a quote or submit a purchasing inquiry today to check availability and lead times for the XC3S1600E-4FG484C.