XC3S1500-4FG676I

The XC3S1500-4FG676I is an AMD Spartan®-3 field programmable gate array supplied in a 676-ball BGA package. It provides a balance of logic capacity, on-chip memory and I/O density for applications that require configurable digital logic in an industrial-temperature-rated device.

With 29,952 logic elements, approximately 0.59 Mbits of embedded RAM and 487 user I/O, this device is suited to designs that need substantial programmable logic, significant I/O count and a robust thermal range for deployment in harsher environments.

Key Features

• Logic Capacity — 29,952 logic elements and approximately 1,500,000 equivalent gates to implement complex custom logic and state machines.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM for buffering, small data stores and logic-local memory needs.
• I/O Density — 487 I/O pins to support wide parallel interfaces, multiple peripheral connections or multi-channel data paths.
• Package and Mounting — 676-BGA (supplier package: 676-FBGA, 27×27) in a surface-mount format for compact board-level integration.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system power-rail planning and power sequencing requirements.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to support deployments in demanding ambient conditions.
• Compliance — RoHS compliant to meet environmental material restrictions.

Typical Applications

• Industrial Automation — Use the device’s industrial temperature rating and high I/O count for control systems, sensor aggregation and real-time logic processing.
• Data Acquisition and Signal Conditioning — Leverage the on-chip RAM and abundant logic resources to implement buffering, preprocessing and protocol handling for multi-channel data streams.
• Embedded System Glue Logic — Deploy as a highly configurable interface and timing controller to bridge processors, memory and custom peripherals using the wide I/O resources.
• Prototyping and Custom Logic — Apply the programmable fabric and gate equivalent capacity for proof-of-concept designs and iterative hardware development.

Unique Advantages

• High Logic Integration: Nearly 30k logic elements enable implementation of sizable custom digital functions without external ASICs.
• Substantial I/O Count: 487 user I/Os reduce the need for external I/O expanders and simplify board-level connectivity for complex systems.
• On-Chip Memory: Approximately 0.59 Mbits of embedded RAM supports local buffering and intermediate storage to improve data throughput and latency.
• Industrial-Grade Operation: −40 °C to 100 °C operating range helps ensure reliable operation in temperature-challenging environments.
• Compact BGA Package: 676-FBGA (27×27) delivers high pin density in a surface-mount footprint suitable for space-constrained PCBs.

Why Choose XC3S1500-4FG676I?

The XC3S1500-4FG676I delivers a practical combination of programmable logic, embedded memory and extensive I/O in an industrial-temperature FPGA from AMD. Its feature set is tailored to engineers who need configurable digital resources with a high pin count and compact BGA packaging for medium-to-high complexity designs.

This device is a strong option for teams seeking a scalable, reprogrammable building block that supports iterative development and integration into industrial systems, offering long-term value through flexibility, integration density and a defined operating envelope.

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