XC3S1500-4FG456C
| Part Description |
Spartan®-3 Field Programmable Gate Array (FPGA) IC 333 589824 29952 456-BBGA |
|---|---|
| Quantity | 1,400 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 333 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3328 | Number of Logic Elements/Cells | 29952 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 589824 |
Overview of XC3S1500-4FG456C – Spartan®-3 Field Programmable Gate Array (FPGA) IC 333 589824 29952 456-BBGA
The XC3S1500-4FG456C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD. It offers a combination of programmable logic, on-chip memory, and extensive I/O in a surface-mount BGA package for commercial-grade applications.
This device provides substantial logic and memory resources for designers who require reconfigurable hardware in a compact 456-ball package while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C temperature window.
Key Features
- Logic Capacity Approximately 29,952 logic elements available for implementing custom digital functions and state machines.
- On-Chip Memory Approximately 0.59 Mbits of embedded memory (589,824 total RAM bits) for buffers, FIFOs, and temporary storage.
- I/O Resources 333 user I/O pins to support a variety of parallel interfaces and board-level connectivity requirements.
- Gate Equivalent Around 1,500,000 gates of logic capacity to support complex designs and combinational/sequential logic blocks.
- Power Operates from a supply voltage range of 1.14 V to 1.26 V, enabling consistent logic levels across the device.
- Package and Mounting Supplied in a 456-ball BGA package (Package Case: 456-BBGA; Supplier device package: 456-FBGA, 23×23) optimized for surface-mount assembly.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for standard commercial applications.
- Regulatory RoHS compliant, supporting lead-free assembly and environmental requirements.
Unique Advantages
- High logic density: The device provides approximately 29,952 logic elements, enabling integration of complex digital functions into a single FPGA.
- Integrated memory: Nearly 0.59 Mbits of embedded RAM reduces external memory needs for many control and buffering tasks.
- Generous I/O count: 333 I/O pins allow flexible interfacing to peripherals, sensors, and system buses without additional expansion chips.
- Compact BGA packaging: The 456-ball BGA (23×23) package delivers a high pin-count in a space-efficient footprint for surface-mount PCBs.
- Commercial-grade operation: Rated 0 °C to 85 °C for deployment in standard commercial environments.
- RoHS compliant: Supports lead-free manufacturing and regulatory conformity.
Why Choose XC3S1500-4FG456C?
The XC3S1500-4FG456C positions itself as a capable Spartan®-3 FPGA option for designers needing a balance of logic capacity, embedded memory, and I/O in a compact surface-mount BGA package. Its supply voltage window and commercial temperature rating make it suitable for a wide range of standard electronics projects where reconfigurable logic and on-chip resources reduce system complexity.
With nearly 30k logic elements, substantial on-chip RAM, and 333 I/O pins, this FPGA supports consolidation of multiple functions onto a single device, helping to simplify BOMs and streamline board layouts while maintaining RoHS compliance.
Request a quote or submit a procurement inquiry for the XC3S1500-4FG456C to receive pricing and availability information tailored to your design needs.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








