XC3S1500-4FG456C

IC FPGA 333 I/O 456FBGA
Part Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 333 589824 29952 456-BBGA

Quantity 1,400 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case456-BBGANumber of I/O333Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3328Number of Logic Elements/Cells29952
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC3S1500-4FG456C – Spartan®-3 Field Programmable Gate Array (FPGA) IC 333 589824 29952 456-BBGA

The XC3S1500-4FG456C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD. It offers a combination of programmable logic, on-chip memory, and extensive I/O in a surface-mount BGA package for commercial-grade applications.

This device provides substantial logic and memory resources for designers who require reconfigurable hardware in a compact 456-ball package while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C temperature window.

Key Features

  • Logic Capacity  Approximately 29,952 logic elements available for implementing custom digital functions and state machines.
  • On-Chip Memory  Approximately 0.59 Mbits of embedded memory (589,824 total RAM bits) for buffers, FIFOs, and temporary storage.
  • I/O Resources  333 user I/O pins to support a variety of parallel interfaces and board-level connectivity requirements.
  • Gate Equivalent  Around 1,500,000 gates of logic capacity to support complex designs and combinational/sequential logic blocks.
  • Power  Operates from a supply voltage range of 1.14 V to 1.26 V, enabling consistent logic levels across the device.
  • Package and Mounting  Supplied in a 456-ball BGA package (Package Case: 456-BBGA; Supplier device package: 456-FBGA, 23×23) optimized for surface-mount assembly.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for standard commercial applications.
  • Regulatory  RoHS compliant, supporting lead-free assembly and environmental requirements.

Unique Advantages

  • High logic density: The device provides approximately 29,952 logic elements, enabling integration of complex digital functions into a single FPGA.
  • Integrated memory: Nearly 0.59 Mbits of embedded RAM reduces external memory needs for many control and buffering tasks.
  • Generous I/O count: 333 I/O pins allow flexible interfacing to peripherals, sensors, and system buses without additional expansion chips.
  • Compact BGA packaging: The 456-ball BGA (23×23) package delivers a high pin-count in a space-efficient footprint for surface-mount PCBs.
  • Commercial-grade operation: Rated 0 °C to 85 °C for deployment in standard commercial environments.
  • RoHS compliant: Supports lead-free manufacturing and regulatory conformity.

Why Choose XC3S1500-4FG456C?

The XC3S1500-4FG456C positions itself as a capable Spartan®-3 FPGA option for designers needing a balance of logic capacity, embedded memory, and I/O in a compact surface-mount BGA package. Its supply voltage window and commercial temperature rating make it suitable for a wide range of standard electronics projects where reconfigurable logic and on-chip resources reduce system complexity.

With nearly 30k logic elements, substantial on-chip RAM, and 333 I/O pins, this FPGA supports consolidation of multiple functions onto a single device, helping to simplify BOMs and streamline board layouts while maintaining RoHS compliance.

Request a quote or submit a procurement inquiry for the XC3S1500-4FG456C to receive pricing and availability information tailored to your design needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up