XC3S1400AN-5FGG484C

The XC3S1400AN-5FGG484C is a Spartan®-3AN Field Programmable Gate Array (FPGA) IC from AMD. It delivers a balanced combination of programmable logic capacity, on‑chip memory, and a high I/O count in a compact 484‑BBGA package for commercial-grade designs.

This device targets applications that require substantial embedded logic and memory resources alongside extensive I/O connectivity, while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C temperature window.

Key Features

• Logic Capacity 25,344 logic elements and 2,816 configurable logic blocks provide substantial on-chip programmable logic for custom digital functions.
• Embedded Memory Approximately 0.59 Mbits of total on-chip RAM bits to support data buffering, state machines, and local storage.
• I/O Density 372 user I/O pins to support parallel interfaces, sensor arrays, and high‑pin‑count system integration.
• Gate Count Approximately 1,400,000 gates of logic capacity to implement complex combinational and sequential logic.
• Package and Mounting 484‑BBGA package (supplier device package: 484‑FBGA, 23×23) in a surface‑mount form factor for compact board layouts.
• Power and Temperature Operates from 1.14 V to 1.26 V supply and rated for commercial temperature operation from 0 °C to 85 °C.
• Environmental Compliance RoHS‑compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Embedded and Custom Logic Implement application‑specific datapaths, control logic, and state machines where a mix of logic elements and on‑chip memory is required.
• I/O‑Intensive Systems Drive parallel interfaces, sensor arrays, or multi‑channel data acquisition systems using the device’s 372 user I/Os.
• Prototyping and System Integration Use the FPGA’s programmable fabric and substantial gate count to prototype complex digital systems or consolidate multiple functions into a single device.

Unique Advantages

• High Logic Density: 25,344 logic elements and ~1.4M gates provide the capacity to implement complex digital designs without immediate need for external logic.
• On‑Chip Memory Availability: Approximately 0.59 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
• Extensive I/O Count: 372 I/O pins enable broad connectivity for sensors, peripherals, and multi‑lane interfaces, simplifying board-level routing.
• Compact BGA Footprint: 484‑BBGA (484‑FBGA, 23×23) delivers a space‑efficient solution for high‑density designs while supporting surface‑mount assembly.
• Commercial Temperature and Low‑Voltage Operation: Designed for 0 °C to 85 °C operation and a 1.14 V–1.26 V supply, suitable for mainstream commercial applications that require low-voltage FPGA operation.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing processes.

Why Choose XC3S1400AN-5FGG484C?

The XC3S1400AN-5FGG484C is positioned for designers who need a robust, commercial‑grade FPGA with ample logic resources, embedded RAM, and a high I/O count in a compact BGA package. Its combination of logic elements, on‑chip memory, and extensive I/O enables consolidation of multiple functions and efficient board-level integration.

This part is well suited for development teams and procurement looking for a commercially rated FPGA solution from AMD that balances integration, connectivity, and manageable power requirements for a wide range of embedded and system‑level applications.

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