XC3S1400AN-4FGG484I

The XC3S1400AN-4FGG484I is a Spartan®-3AN field programmable gate array (FPGA) offering a high-density programmable logic platform with integrated on-chip memory and extensive I/O. It provides 25,344 logic elements and approximately 0.59 Mbits of embedded memory to support complex digital designs that require substantial logic and data buffering on a single device.

Designed for industrial use, this surface-mount FPGA supports a broad supply voltage window and an extended operating temperature range, making it suitable for applications that demand reliability, scalability, and in-field configurability.

Key Features

• Core Logic — 25,344 logic elements provide significant programmable logic capacity for custom digital functions and complex state machines.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM to support data buffering, FIFOs, and small on-chip storage needs.
• I/O Capacity — 372 user I/O pins to support multiple parallel interfaces and external device connectivity.
• Gate Count — Equivalent to 1,400,000 gates, enabling integration of substantial digital functionality on a single device.
• Power Supply — Core voltage supply range of 1.14 V to 1.26 V to match system power architectures requiring this operating window.
• Package & Mounting — 484-BBGA surface-mount package (supplier package: 484-FBGA, 23×23) for compact board-level integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet extended-temperature deployment requirements.
• Environmental Compliance — RoHS compliant for designs targeting lead-free manufacturing and regulatory compliance.

Typical Applications

• Custom digital logic and prototyping — Use the FPGA’s 25,344 logic elements and embedded memory to implement and iterate custom logic designs on a single device.
• High-density I/O control — Leverage 372 I/O pins for parallel control, signal aggregation, or multi-channel interfacing in board-level systems.
• Data buffering and on-chip storage — Employ approximately 0.59 Mbits of embedded RAM for data buffering, small FIFOs, and temporary storage within logic pipelines.

Unique Advantages

• High logic density: 25,344 logic elements enable consolidation of complex functions that would otherwise require multiple discrete devices.
• Significant on-chip memory: Approximately 0.59 Mbits of embedded RAM reduces the need for external memory for many buffering and temporary storage tasks.
• Extensive I/O count: 372 user I/O pins simplify board-level integration for multi-channel and parallel interfaces.
• Industrial temperature capability: −40 °C to 100 °C rating supports deployment in environments with extended temperature requirements.
• Compact BGA package: 484-BBGA (484-FBGA, 23×23) allows for high-density PCB layouts while maintaining strong electrical performance.
• RoHS compliant: Supports lead-free manufacturing flows and regulatory compliance for modern production processes.

Why Choose XC3S1400AN-4FGG484I?

The XC3S1400AN-4FGG484I positions itself as a robust, industrial-grade FPGA option for designs that require large logic capacity, ample embedded memory, and a high number of I/O lines in a compact BGA package. Its operating voltage window and extended temperature range deliver design flexibility for a variety of system architectures and environmental conditions.

This device is well suited to engineers and procurement teams seeking a single-chip solution that balances logic density, on-chip storage, and board-level integration, while also meeting RoHS requirements for modern production standards.

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