XC3S1400AN-4FG676I

The XC3S1400AN-4FG676I is an industrial-grade Spartan®-3AN FPGA offering a balance of logic capacity, on-chip memory and I/O density in a 676-ball FBGA package. Built for embedded and system-level designs, it provides reprogrammable logic resources suitable for control, interface and signal-processing tasks where robust operating range and high I/O count are required.

Key Features

• Logic Capacity — 2,816 CLBs delivering 25,344 logic elements to implement complex combinational and sequential logic.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM for buffering, state storage and local data processing.
• I/O Density — 502 I/O pins to support wide parallel interfaces, multiple peripherals and flexible board-level connectivity.
• Gate Count — 1,400,000 gates providing substantial fabric scalability for medium-complexity designs.
• Power — Core supply range from 1.14 V to 1.26 V to match system power domains and optimize power distribution.
• Package & Mounting — 676-FBGA (27 × 27) surface-mount package for compact board layouts and high pin count routing.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• Industrial Control Systems — Use the device’s industrial temperature rating and high I/O count for sensor aggregation, motor control logic and distributed I/O tasks.
• Embedded Signal Processing — Leverage the logic fabric and on-chip RAM for real-time data handling, protocol bridging and preprocessing functions.
• Communications Interfaces — Implement parallel and custom serial interfaces using abundant I/O and programmable logic to adapt to evolving protocol needs.
• Prototyping and Modular Designs — Use reprogrammability and significant gate count to validate algorithms and iterate hardware functions before production.

Unique Advantages

• Substantial Logic Resources: 25,344 logic elements enable implementation of multi-function designs without immediate need for external logic.
• High I/O Availability: 502 I/Os simplify board-level integration by reducing the need for external I/O expanders or multiplexers.
• Embedded Memory On-Chip: Approximately 0.59 Mbits of RAM reduce external memory dependence for buffering and local data storage.
• Industrial Operating Range: −40 °C to 100 °C rating supports deployment in rugged and temperature-variable environments.
• Compact, High-Pin Package: 676-FBGA (27 × 27) provides dense connectivity in a compact footprint for space-constrained boards.
• RoHS Compliance: Facilitates regulatory and environmental requirements for lead-free assembly processes.

Why Choose XC3S1400AN-4FG676I?

The XC3S1400AN-4FG676I positions itself as a durable, mid-density FPGA option that combines a solid complement of logic elements, embedded memory and very high I/O count in a single industrial-grade package. It is well suited to engineering teams building embedded control, interface and signal-processing solutions that require reprogrammability, rugged temperature performance and compact board integration.

With clear electrical and mechanical characteristics—defined core voltage range, package details and RoHS compliance—this part supports designs that demand predictable operating conditions, simplified BOM and flexible hardware updates throughout a product lifecycle.

Request a quote or submit an inquiry to check availability and pricing for the XC3S1400AN-4FG676I and to discuss how it fits your next design.