XC3S1400A-5FTG256C

The XC3S1400A-5FTG256C is a Spartan®-3A field programmable gate array (FPGA) provided in a 256-ball LFBGA package for surface-mount applications. It offers 25,344 logic elements, approximately 0.59 Mbits of embedded memory, and 161 user I/O pins, delivering a balanced combination of logic capacity and on-chip RAM for commercial designs.

Designed for commercial-grade systems, the device operates from a 1.14 V to 1.26 V core supply and across a 0 °C to 85 °C temperature range. RoHS compliant, it supports compact board-level integration with a 256-FTBGA (17×17) supplier package option.

Key Features

• Core Logic  25,344 logic elements and approximately 1,400,000 gates provide substantial programmable logic resources for mid-range designs.
• Configurable Logic Blocks  Architecture sized for broad commercial applications that require flexible logic implementation.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM to support data buffering, temporary storage, and memory-intensive logic functions.
• I/O Capacity  161 user I/O pins enable multiple external interfaces and board-level connectivity.
• Power  Core voltage supply range of 1.14 V to 1.26 V for standard FPGA power domains.
• Package & Mounting  256-LBGA (supplier package: 256-FTBGA 17×17) in a surface-mount footprint for compact PCB layouts.
• Operating Conditions  Commercial-grade operation from 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

• Commercial Embedded Systems  Use the FPGA to implement custom logic, protocol bridging, and board-level integration within commercial product designs.
• Prototyping and Development  Leverage the device’s logic capacity and on-chip RAM for hardware prototyping and iterative design validation.
• Digital Integration Tasks  Deploy the FPGA for logic consolidation, interface adaptation, and on-board data buffering where mid-range resources are required.

Unique Advantages

• High Logic Capacity: 25,344 logic elements and roughly 1.4 million gates provide the resources to implement complex state machines, combinatorial logic, and moderate parallel processing.
• Embedded Memory On-Chip: Approximately 0.59 Mbits of RAM reduces external memory requirements for many buffering and temporary storage tasks.
• Ample I/O: 161 user I/O pins support diverse board-level interfaces and signal routing options.
• Compact BGA Package: 256-LBGA (256-FTBGA, 17×17) enables dense PCB integration in space-constrained designs.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant to meet commercial product requirements.
• Surface-Mount Mounting: Standard surface-mount packaging simplifies automated assembly and PCB manufacturing.

Why Choose XC3S1400A-5FTG256C?

The XC3S1400A-5FTG256C positions itself as a commercially graded FPGA option that combines a sizable logic array, meaningful on-chip RAM, and broad I/O in a compact BGA package. It is suited to design teams seeking mid-range programmable capacity for commercial embedded systems, prototyping, and board-level integration where on-chip memory and I/O flexibility matter.

With defined operating voltage and temperature ranges and RoHS compliance, this device supports sustained, repeatable integration into commercial product lines while maintaining a compact footprint and standard surface-mount assembly.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S1400A-5FTG256C for your next commercial design.