XC3S1400A-5FGG484C

The XC3S1400A-5FGG484C is a Spartan®-3A family Field Programmable Gate Array manufactured by AMD. It delivers substantial programmable logic capacity alongside significant on-chip memory and a high I/O count in a compact ball-grid array package.

Designed for commercial-temperature applications, this surface-mount FPGA targets designs that require a balance of logic density, embedded RAM, and numerous I/O connections while operating from a narrow core-voltage range.

Key Features

• Core Logic 25,344 logic elements and approximately 1,400,000 gates provide a large programmable fabric for implementing complex digital functions.
• Embedded Memory Approximately 0.59 Mbits of on-chip RAM (589,824 total RAM bits) to support data buffering, state storage, and intermediate processing.
• I/O Density 375 general-purpose I/O pins enable connectivity for multiple peripherals, interfaces, and external devices.
• Power Operates from a core voltage supply range of 1.14 V to 1.26 V to match system power-rail requirements.
• Package & Mounting 484-ball BGA package (supplier device package: 484-FBGA, 23×23) in surface-mount form factor for compact board integration.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental conformity.

Typical Applications

• Embedded System Integration — Use the FPGA’s logic capacity and embedded RAM to consolidate glue logic, custom state machines, and protocol adapters in embedded products.
• I/O-Intensive Control — High I/O count supports multi-channel sensor interfaces, display control, and parallel peripheral connectivity.
• Prototyping and System Validation — Implement and iterate on complex digital functions and board-level interfaces during development and testing cycles.

Unique Advantages

• High Logic Capacity: 25,344 logic elements enable implementation of complex custom logic without multiple discrete components.
• Significant On‑Chip Memory: Approximately 0.59 Mbits of embedded RAM reduce dependency on external memory for many buffering and state-storage needs.
• Extensive I/O Count: 375 I/O pins simplify interfacing multiple peripherals and external devices on a single FPGA.
• Compact BGA Packaging: 484-BBGA (484-FBGA, 23×23) supports high-density board designs while maintaining a small footprint.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to match standard commercial deployments.
• RoHS Compliant: Meets lead-free environmental standards for modern electronics manufacturing.

Why Choose XC3S1400A-5FGG484C?

The XC3S1400A-5FGG484C positions itself as a versatile, high-capacity Spartan®-3A FPGA solution from AMD, offering a blend of substantial logic resources, on-chip RAM, and a large number of I/Os in a compact BGA package. Its commercial-temperature rating and RoHS compliance make it suitable for standard embedded and electronic designs that require integration and scalability.

This device is well suited for engineers and designers who need to consolidate digital functions, support multiple interfaces, and maintain a compact board footprint while operating within a narrow core-voltage rail. The combination of logic density, embedded memory, and I/O capability provides long-term design flexibility and simplified BOM considerations.

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