XC3S1400A-4FT256I

The XC3S1400A-4FT256I is a Spartan®-3A field programmable gate array (FPGA) from AMD, provided in a 256-LBGA package. It delivers a large programmable fabric with 25,344 logic elements, approximately 0.59 Mbits of embedded memory, and 161 user I/Os for designs that require significant on-chip logic and I/O integration.

Designed for industrial environments, this surface-mount device operates over a supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, while meeting RoHS compliance requirements.

Key Features

• Core Logic 25,344 logic elements provide substantial programmable logic capacity for custom digital functions and glue-logic integration.
• Embedded Memory Approximately 0.59 Mbits of on-chip RAM to support FIFOs, buffers, and small data stores without external memory.
• I/O Density 161 user I/Os support high pin-count interfaces and flexible connectivity options for multiple peripherals and buses.
• Gate Count 1,400,000 gates of logic resources for implementing complex state machines and datapaths.
• Package & Mounting 256-LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount form factor for compact board integration.
• Power Operates from a core supply range of 1.14 V to 1.26 V to match regulated FPGA power rails.
• Temperature Range Industrial-grade operating temperature from −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Industrial Control Use the FPGA’s logic capacity and industrial temperature rating to implement custom control, sequencing, and interface logic in factory and process automation.
• Embedded Systems Implement custom peripherals, protocol bridges, and hardware accelerators using the device’s logic elements and on-chip memory.
• I/O-Intensive Designs Leverage 161 user I/Os to connect multiple sensors, actuators, or bus interfaces within a single programmable device.

Unique Advantages

• High Logic Density: 25,344 logic elements enable consolidation of multiple functions into one FPGA, reducing board-level component count.
• On-Chip Memory: Approximately 0.59 Mbits of embedded RAM reduces reliance on external memory for small buffers and state storage.
• Industrial Temperature Rating: Certified to operate from −40 °C to 100 °C for reliable performance in harsh environments.
• Strong I/O Capability: 161 user I/Os accommodate complex system interfacing without extensive external multiplexing.
• Compact Package: 256-LBGA (256-FTBGA, 17×17) provides a small footprint solution suitable for space-constrained designs.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose XC3S1400A-4FT256I?

The XC3S1400A-4FT256I combines substantial programmable logic, embedded memory, and high I/O count in a compact 256-LBGA package tailored for industrial applications. Its operating voltage and temperature specifications make it suitable for designs needing reliable, long-term operation in demanding conditions.

This device is well suited to engineers and procurement teams looking to consolidate multiple digital functions into a single FPGA, reduce BOM complexity, and maintain compliance with RoHS requirements while meeting industrial temperature needs.

Request a quote or submit a request for pricing and availability to evaluate the XC3S1400A-4FT256I for your next design.