XC3S1400A-4FGG484C

The XC3S1400A-4FGG484C is a Spartan®-3A FPGA IC configured in a 484-BBGA package for surface-mount assembly. It provides a substantial logic fabric with 25,344 logic elements and approximately 0.59 Mbits of embedded RAM to support complex digital designs.

With up to 375 I/O pins and an internal gate count of 1,400,000, this commercial-grade, RoHS-compliant device targets applications that require significant I/O capacity and on-chip resources while operating from a core supply of 1.14 V to 1.26 V over a 0 °C to 85 °C temperature range.

Key Features

• Core Logic – Provides 25,344 logic elements to implement complex combinational and sequential logic functions.
• Logic Block Count – The device contains 2,816 logic blocks to structure implemented logic.
• Embedded Memory – Approximately 0.59 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
• I/O Capacity – Up to 375 user I/Os to support multi‑port interfaces and dense connectivity requirements.
• Integration Density – Equivalent of 1,400,000 gates to accommodate sizable digital functions within a single device.
• Power – Core supply voltage range of 1.14 V to 1.26 V to match targeted power domains.
• Package & Mounting – 484-BBGA (supplier package 484-FBGA, 23 × 23) in a surface-mount form factor for compact board layouts.
• Operating Range & Grade – Commercial grade with an operating temperature range of 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Interface and Bridge Logic – Systems requiring high I/O counts can use the 375 I/Os to implement protocol bridging and signal multiplexing.
• Accelerated Data Path – Designs that need substantial on-chip RAM and logic resources can implement buffering and custom processing pipelines using the ~0.59 Mbits of embedded memory and 25,344 logic elements.
• System Integration – Compact, surface-mount 484-BBGA packaging supports integration into space-constrained boards that demand significant gate density.

Unique Advantages

• High Logic Capacity: 25,344 logic elements enable implementation of complex state machines, controllers, and glue logic within a single FPGA.
• Substantial Embedded Memory: Approximately 0.59 Mbits of on-chip RAM reduces the need for external memory in many buffering and local storage use cases.
• Extensive I/O Resources: Up to 375 I/Os provide flexibility for multi-interface designs and high pin-count connectivity.
• Compact, Surface-Mount Package: The 484-BBGA (484-FBGA, 23 × 23) package balances pin density and board real estate for compact system designs.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant for typical commercial deployments.
• Predictable Core Supply: A defined core voltage range of 1.14 V to 1.26 V supports consistent power domain planning.

Why Choose XC3S1400A-4FGG484C?

The XC3S1400A-4FGG484C positions itself as a capable commercial-grade FPGA offering a balance of logic density, embedded memory, and I/O capacity in a compact 484-BBGA package. Its combination of approximately 25k logic elements, roughly 0.59 Mbits of RAM, and up to 375 I/Os makes it suitable for designs that require significant on-chip resources without moving to larger or multiple devices.

For engineering teams focused on integration density and robust on-chip resources, this device delivers a clear specification set—power, thermal, and packaging—suitable for many commercial embedded and system-level applications where these attributes are required.

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