XC3S1400A-4FG676C

The XC3S1400A-4FG676C is a Spartan®-3A field programmable gate array (FPGA) IC from AMD, supplied in a 676-FBGA (27×27) surface-mount package. It is a commercial-grade FPGA designed to provide substantial logic capacity, on-chip memory, and high I/O density for embedded designs.

Key device-level specifications include approximately 25,344 logic elements, about 0.59 Mbits of embedded RAM, 502 I/O pins, an estimated 1,400,000 gates, and a supply voltage range of 1.14 V to 1.26 V, with an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity Approximately 25,344 logic elements and an estimated 1,400,000 gates provide substantial on-chip programmable logic for medium-to-high complexity designs.
• Embedded Memory Approximately 589,824 bits (≈0.59 Mbits) of on-chip RAM to support buffering, state storage, and data handling without external memory for many use cases.
• I/O Density 502 general-purpose I/O pins enable broad connectivity to peripherals, sensors, and interface circuitry.
• Power Single-core supply range of 1.14 V to 1.26 V supports the device’s core operation within defined voltage margins.
• Package & Mounting Supplied in a 676-FBGA (27×27) package case (676-BGA) with surface-mount mounting for compact PCB integration.
• Operating Range Commercial-grade temperature rating from 0 °C to 85 °C suitable for typical commercial electronic environments.
• Environmental Compliance RoHS compliant to support lead-free assembly and environmental regulatory preferences.

Typical Applications

• Commercial Embedded Systems Custom logic and I/O consolidation in commercial embedded products that require moderate-to-high programmable logic and memory.
• High-Density I/O Designs Systems needing large numbers of interfaces or parallel connections can leverage the 502 I/O pins for broad external connectivity.
• Prototyping and Development Hardware development and proof-of-concept platforms that benefit from a reprogrammable, commercially rated FPGA with substantial logic and RAM resources.

Unique Advantages

• High Logic Integration: Approximately 25,344 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• On-Chip Memory: About 0.59 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage tasks.
• Extensive I/O: 502 I/O pins provide flexibility to interface directly with numerous peripherals and signals, simplifying system routing.
• Compact, Surface-Mount Package: 676-FBGA (27×27) packaging supports high-density PCB designs while maintaining a manageable footprint.
• Commercial Temperature and RoHS Compliance: Operates across a 0 °C to 85 °C range and is RoHS compliant, aligning with common commercial manufacturing and environmental requirements.
• Low-Voltage Core Operation: Core supply range of 1.14 V to 1.26 V supports integration into modern low-voltage power architectures.

Why Choose XC3S1400A-4FG676C?

The XC3S1400A-4FG676C balances substantial programmable logic and on-chip memory with high I/O capacity in a compact 676-FBGA package. Its commercial-grade operating range and RoHS compliance make it suitable for a wide range of commercial embedded projects where moderate-to-high logic density and connectivity are required.

Engineers and procurement teams looking for a field-programmable solution from AMD with approximately 25,344 logic elements, around 0.59 Mbits of embedded RAM, and 502 I/O pins will find this device a practical option for consolidating functions, reducing BOM complexity, and accelerating development cycles.

Request a quote or submit an inquiry for pricing and availability of the XC3S1400A-4FG676C to support your next commercial FPGA design.