XC3S1200E-5FTG256C

The XC3S1200E-5FTG256C is a Spartan®-3E field programmable gate array from AMD, packaged in a 256-LBGA (256-FTBGA, 17×17) surface-mount package. It delivers medium-density programmable logic with 19,512 logic elements, on-chip embedded memory, and 190 user I/O pins for a range of digital integration tasks.

Designed for commercial-grade applications, this FPGA operates from a core supply range of 1.14 V to 1.26 V and is specified for 0 °C to 85 °C operation. The device is RoHS compliant and targets designs that require a balance of logic capacity, embedded memory, and I/O connectivity in a compact BGA package.

Key Features

• Logic Capacity — 19,512 logic elements provide substantial programmable logic resources for mid-density designs.
• Embedded Memory — Approximately 0.52 Mbits (516,096 bits) of on-chip RAM suitable for buffering, small FIFOs, and local data storage.
• I/O Count — 190 user I/O pins to interface with peripherals, sensors, and external devices.
• Gate Equivalent — Approximately 1,200,000 gates of functionality for integrating complex digital logic.
• Package and Mounting — 256-LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount form factor to support compact PCB layouts.
• Power — Core voltage supply specified between 1.14 V and 1.26 V for defined low-voltage operation.
• Temperature and Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant for adherence to common materials restrictions.

Typical Applications

• General-purpose digital logic — Implement custom control, glue logic, and protocol bridging using the device’s 19,512 logic elements and flexible I/O count.
• Memory-buffered processing — Leverage approximately 0.52 Mbits of embedded RAM for data buffering, small FIFOs, and local storage in streaming or packet-based designs.
• I/O-intensive interfaces — Use 190 I/O pins to connect to multiple peripherals, sensors, and external interfaces in compact systems.

Unique Advantages

• Balanced logic and memory — Combines 19,512 logic elements with embedded RAM to consolidate functionality that otherwise would require multiple components.
• Compact BGA package — 256-LBGA (17×17) package enables higher density PCBs and efficient board area utilization.
• Defined low-voltage core — 1.14 V to 1.26 V supply specification supports designs targeting lower core voltages.
• High I/O count — 190 I/Os provide flexibility to connect numerous external signals without additional I/O expansion.
• RoHS compliant — Meets common environmental material requirements for commercial products.
• Commercial temperature rating — Rated for 0 °C to 85 °C to suit a wide range of standard commercial applications.

Why Choose XC3S1200E-5FTG256C?

The XC3S1200E-5FTG256C positions itself as a practical choice for designers needing a medium-density FPGA with a balanced mix of logic elements, embedded memory, and a high I/O count in a compact 256-LBGA package. Its specified voltage range, commercial temperature rating, and RoHS compliance make it suitable for a variety of standard commercial electronic products and embedded systems.

This AMD Spartan®-3E device is well suited for projects that require consolidating discrete logic and small memory functions into a single programmable component, reducing board complexity and component count while maintaining clear electrical and thermal specifications.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S1200E-5FTG256C.