XC3S1200E-5FGG320C

The XC3S1200E-5FGG320C is a Spartan®-3E field programmable gate array (FPGA) in a 320‑ball BGA package. It integrates 19,512 logic elements, approximately 0.516 Mbits of embedded RAM, and 250 user I/O pins to support medium-density, programmable logic designs. The device is supplied for commercial-grade applications with an operating range of 0 °C to 85 °C and a core voltage range of 1.14 V to 1.26 V.

Key Features

• Core Logic  Provides 19,512 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffering, state storage, and small memory blocks.
• I/O Resources  Up to 250 user I/O pins enable broad connectivity to external devices and peripherals.
• Implementation Scale  Device silicon corresponds to 1,200,000 gates, suitable for medium-complexity logic integration.
• Power  Core supply voltage range specified at 1.14 V to 1.26 V for predictable power planning and supply design.
• Package  320‑BGA / 320‑FBGA (19 × 19) package supports a compact board footprint and high I/O density.
• Temperature and Grade  Commercial grade device rated for 0 °C to 85 °C ambient operation.
• Mounting  Surface-mount package for standard PCB assembly processes.

Unique Advantages

• Moderate logic density: 19,512 logic elements permit significant functional integration without excessive board-level complexity.
• Integrated on-chip memory: Approximately 0.516 Mbits of RAM reduces the need for external memory in many buffering and control tasks.
• High I/O count: 250 user I/Os allow flexible interfacing to sensors, controllers, and external peripherals.
• Compact BGA package: 320‑ball FBGA (19 × 19) offers a small PCB footprint while maintaining pin density for complex routing.
• Predictable power envelope: Defined core voltage range (1.14 V–1.26 V) simplifies power supply design and system integration.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with standard commercial electronic applications.

Why Choose XC3S1200E-5FGG320C?

The XC3S1200E-5FGG320C positions itself as a medium-density FPGA option that balances logic capacity, on-chip memory, and I/O flexibility in a compact 320‑BGA package. It is well suited to projects that require substantial programmable logic resources and embedded RAM within a commercial temperature range and a defined core voltage window.

Designers and procurement teams looking for a reliably specified Spartan®-3E device—offering clear quantities for logic elements, RAM, I/Os, and package type—can use this device to streamline BOMs and system integration while relying on documented electrical and environmental parameters.

If you would like pricing, availability, or to request a formal quote for the XC3S1200E-5FGG320C, please submit a quote request or pricing inquiry and our team will respond with the necessary details.