XC3S1200E-5FGG400C

The XC3S1200E-5FGG400C is an AMD Spartan®-3E Field Programmable Gate Array supplied in a 400-ball BGA package. It provides a programmable logic fabric with 2168 configurable logic blocks and 19,512 logic elements for implementing custom digital logic.

Key device characteristics include approximately 0.516 Mbits of embedded RAM, 304 user I/O pins, about 1,200,000 gates, a surface-mount 400-FBGA (21×21) package, a supply voltage range of 1.14 V to 1.26 V, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core Architecture  Sparton®-3E FPGA fabric with 2168 configurable logic blocks (CLBs) for flexible digital logic implementation.
• Logic Resources  19,512 logic elements providing the capacity to implement complex combinational and sequential logic functions across the device.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM available for data buffering, state storage, and small lookup tables.
• I/O and Connectivity  304 user I/O pins to support multiple external interfaces and board-level signal routing.
• Logic Gates  Approximately 1,200,000 gates indicating overall device resource scale for integration of multiple functions.
• Package and Mounting  400-ball FBGA (21×21) surface-mount package designed for compact board integration.
• Power  Core supply voltage specified from 1.14 V to 1.26 V for device operation.
• Temperature Range  Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom Digital Logic  Implement application-specific digital functions where configurable logic and moderate on-chip memory are required.
• I/O Expansion and Interface Bridging  Use the 304 available I/O pins to connect and translate between multiple board-level interfaces.
• Prototyping and Development  Deployable for lab and development environments needing reconfigurable hardware resources and sizable logic capacity.
• Embedded Control and Signal Processing  Suitable for embedded control tasks and small-scale signal processing leveraging the device's logic elements and embedded RAM.

Unique Advantages

• High Logic Capacity: 19,512 logic elements and about 1.2M gates enable integration of multiple functions into a single device, reducing component count.
• Substantial On‑Chip Memory: Approximately 0.516 Mbits of embedded RAM supports data buffering and stateful logic without external memory.
• Extensive I/O Count: 304 I/O pins provide flexibility for interfacing with sensors, peripherals, and other digital subsystems.
• Compact BGA Packaging: 400-FBGA (21×21) surface-mount package helps conserve board area while supporting a high pin count.
• Clear Power Envelope: Defined core supply range of 1.14 V to 1.26 V simplifies power-rail planning for the FPGA core.
• RoHS Compliant: Meets RoHS environmental requirements for lead-free assembly.

Why Choose XC3S1200E-5FGG400C?

The XC3S1200E-5FGG400C offers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 400-FBGA package. Its resource set is suited to designers who need reconfigurable logic and on-chip RAM to consolidate multiple digital functions while maintaining a defined commercial operating range and power envelope.

This part is appropriate for development and production designs that require a configurable FPGA platform with measurable, verifiable device resources and RoHS compliance. It provides straightforward scalability for teams working within the Spartan-3E device family and seeking a reliable, surface-mount solution.

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