XC3S1400A-4FG484I

The XC3S1400A-4FG484I is a Spartan®-3A Field Programmable Gate Array (FPGA) from AMD in a 484-ball BBGA package. It provides mid-range programmable logic density with integrated on-chip memory and a high I/O count for system-level integration.

Designed for industrial environments, this surface-mount FPGA operates from a 1.14 V to 1.26 V supply and across an operating temperature range of −40 °C to 100 °C, making it suitable for temperature-demanding applications that require significant I/O and embedded memory resources.

Key Features

• Logic Capacity — 25,344 logic elements and approximately 1,400,000 gates provide the programmable resources needed for medium-complexity digital designs.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM (589,824 bits) for buffering, state storage, and small data structures without external memory.
• I/O Connectivity — 375 I/O pins to support dense peripheral and system interfacing requirements.
• Power — Operates from a 1.14 V to 1.26 V core supply, enabling predictable power planning for the programmable logic core.
• Package & Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23×23) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Grade — Rated for −40 °C to 100 °C operation and supplied as an industrial-grade component for temperature-critical deployments.
• Compliance — RoHS compliant, supporting environmental regulatory requirements for lead-free manufacturing.

Typical Applications

• Industrial Control — Implements motor control logic, sequencing, and field I/O aggregation with industrial temperature operation and extensive I/O.
• Embedded System Integration — Provides programmable glue logic, interface bridging, and protocol handling where integrated on-chip memory and abundant I/O reduce external components.
• Data Acquisition and Processing — Supports buffering and preprocessing of sensor data using the device’s embedded RAM and logic resources.
• Prototyping and Development — Serves as a mid-range FPGA target for validating designs that require substantial I/O and moderate logic density.

Unique Advantages

• Substantial Logic Resources: 25,344 logic elements enable implementation of complex state machines and custom datapaths without moving to larger device families.
• Integrated On-Chip Memory: Approximately 0.59 Mbits of embedded RAM reduces the need for external memory for many buffering and control tasks, simplifying BOM and board layout.
• High I/O Count: 375 I/Os allow direct connection to multiple peripherals and interfaces, minimizing external multiplexers or interface ICs.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation, making the device suitable for deployment in temperature-sensitive industrial environments.
• Compact Surface-Mount Package: 484-BBGA (484-FBGA, 23×23) provides a high-pin-count solution in a compact footprint for space-constrained boards.
• RoHS Compliant: Meets lead-free manufacturing requirements for environmentally conscious production processes.

Why Choose XC3S1400A-4FG484I?

The XC3S1400A-4FG484I balances significant programmable logic and embedded memory with a high I/O count in a compact 484-BBGA surface-mount package, making it well suited for industrial and embedded system designs that require mid-range logic capacity and robust temperature performance. Its 1.14 V–1.26 V supply and RoHS compliance support modern power and manufacturing requirements.

This AMD Spartan®-3A device is targeted at engineers and procurement teams building systems that need integrated memory, plentiful I/O, and industrial-temperature operation without moving to larger device classes—offering a clear option for applications where board-level integration and environmental range are priorities.

Request a quote or submit an inquiry for pricing and availability for the XC3S1400A-4FG484I to get started with your design evaluation and procurement.