XC3S1200E-4FTG256C

The XC3S1200E-4FTG256C is a Spartan®-3E Field Programmable Gate Array (FPGA) from AMD, delivered in a 256-LBGA package. It provides a programmable logic fabric with 19,512 logic elements, approximately 0.516 Mbits of embedded memory, and 190 user I/O, packaged for surface-mount applications.

Designed for commercial-grade systems, the device operates from 1.14 V to 1.26 V and across a 0 °C to 85 °C temperature range, offering a balance of integration and flexibility for custom digital designs that require moderate logic density and on-chip RAM.

Key Features

• Core Logic  19,512 logic elements provide a programmable fabric for implementing custom digital functions and control logic.
• On-Chip Memory  Approximately 0.516 Mbits of embedded RAM for buffering, small data storage, and state retention within designs.
• I/O and System Integration  190 user I/O pins support multiple peripheral interfaces and board-level connectivity, enabling complex interconnect and glue logic.
• Gate Equivalent  1,200,000 equivalent gates for sizing and comparing integration to other programmable solutions.
• Power  Voltage supply range of 1.14 V to 1.26 V for core power domains to match system power rails and design constraints.
• Package and Mounting  256-LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount form factor for high-density PCB assemblies.
• Temperature and Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature and compliant with RoHS environmental requirements.

Typical Applications

• Custom digital logic — Implement application-specific processing, control algorithms, and glue logic using the device's 19,512 logic elements.
• Interface bridging and I/O expansion — Use 190 I/O pins to consolidate multiple peripheral interfaces or implement protocol conversion on a single device.
• Embedded buffering and small-data storage — Approximately 0.516 Mbits of on-chip RAM supports buffering, FIFOs, and temporary data retention without external memory.

Unique Advantages

• High integration density: 19,512 logic elements and 1.2M gate-equivalent capacity enable complex logic implementation within a single FPGA, reducing component count.
• On-chip memory availability: Approximately 0.516 Mbits of embedded RAM minimizes reliance on external memory for small buffers and state machines.
• Flexible I/O resources: 190 user I/O provide broad connectivity options for multi-peripheral systems and board-level interface consolidation.
• Compact surface-mount package: 256-LBGA (17×17 FTBGA form) supports high-density PCB designs while maintaining a standardized mounting approach.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation, making it appropriate for a wide range of commercial electronic products.
• RoHS compliant: Environmentally compliant manufacturing and materials to meet regulatory requirements.

Why Choose XC3S1200E-4FTG256C?

The XC3S1200E-4FTG256C offers a well-balanced combination of logic capacity, embedded memory, and I/O density in a compact 256-LBGA package. Its electrical and thermal specifications make it a practical choice for commercial embedded systems that require integrated digital logic, interface consolidation, and on-chip buffering without the need for external memory resources.

This device is suited for designers seeking a scalable, programmable platform to consolidate multiple functions onto a single component, simplify board layouts, and reduce bill-of-materials in commercial electronic products.

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