XC3S1200E-4FT256I

The XC3S1200E-4FT256I is a Spartan®-3E field programmable gate array (FPGA) from AMD supplied in a 256-LBGA package. It provides a defined logic capacity and on-chip memory footprint for hardware-implemented digital functions.

Key on-chip resources include 19,512 logic elements (2,168 CLBs), approximately 0.52 Mbits of embedded memory (516,096 total RAM bits), up to 190 user I/O pins, and a gate count of 1,200,000. The device is specified for industrial temperature operation and surface-mount assembly.

Key Features

• Core Logic  19,512 logic elements (2,168 CLBs) and 1,200,000 gates provide the device-level capacity for implementing custom digital logic and finite-state machines.
• Embedded Memory  Approximately 0.52 Mbits (516,096 bits) of on-chip RAM for buffering, LUT-based storage, and small data structures.
• I/O  Up to 190 user I/O pins to interface with external peripherals, sensors, and other digital ICs.
• Power  Core supply specified at 1.14 V to 1.26 V to match system power-rail requirements.
• Package & Mounting  256-LBGA package (supplier device package: 256-FTBGA 17×17) with surface-mount mounting for compact PCB integration.
• Temperature Range & Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Embedded control and glue-logic  Implement custom control state machines and interface bridging using the device’s logic elements and available I/O count.
• Custom digital processing  Build tailored parallel logic and small buffering structures that leverage the 19,512 logic elements and approximately 0.52 Mbits of on-chip RAM.
• Prototyping and hardware acceleration  Use the FPGA to prototype fixed-function hardware or accelerate specific computation blocks within an industrial temperature environment.

Unique Advantages

• Clear resource profile: Exact counts for logic elements (19,512), CLBs (2,168), gates (1,200,000), and on-chip RAM (516,096 bits) make capacity planning straightforward for system designers.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in temperature-sensitive industrial applications.
• High I/O density: Up to 190 user I/O pins enable flexible interfacing with sensors, peripherals, and external memory or logic devices.
• Compact package: 256-LBGA (256-FTBGA, 17×17) package allows a dense board layout while maintaining surface-mount assembly compatibility.
• Defined core supply range: Core voltage specified between 1.14 V and 1.26 V helps align power-supply design and margin analysis.
• RoHS compliant: Conforms to RoHS requirements for restricted substances.

Why Choose XC3S1200E-4FT256I?

The XC3S1200E-4FT256I delivers a well-defined set of FPGA resources—logic elements, CLBs, on-chip RAM, and I/O—packaged for surface-mount assembly and rated for industrial temperature operation. This combination makes it suitable for embedded digital designs that require deterministic resource budgeting and robust temperature performance.

Designers and procurement teams can rely on the part’s clear specification set for capacity planning, board-level integration, and power-rail alignment, providing predictable behavior across development and deployment phases.

Request a quote or submit an inquiry to receive pricing, lead-time, and ordering information for the XC3S1200E-4FT256I.