XC3S1200E-4FTG256I

The XC3S1200E-4FTG256I is a Spartan®-3E field programmable gate array (FPGA) provided in a 256-LBGA package. It delivers mid-range programmable logic capacity, embedded memory, and a broad I/O count suitable for industrial embedded and control applications that require deterministic logic resources and extended temperature operation.

Key Features

• Core Logic 2,168 CLBs and 19,512 logic elements (cells) provide programmable logic capacity equivalent to 1,200,000 gates for implementing custom digital functions.
• Embedded Memory Approximately 0.52 Mbits of on-chip RAM (516,096 total RAM bits) for local buffering, FIFOs, and small data storage.
• I/O Capability 190 user I/O pins to support multiple interfaces and peripherals directly on the FPGA.
• Power Core voltage supply range of 1.14 V to 1.26 V to match board-level power rail requirements.
• Package & Mounting 256-LBGA package (supplier device package: 256-FTBGA, 17×17) designed for surface-mount PCB assembly to minimize board area.
• Temperature & Grade Industrial-grade operation from −40 °C to 100 °C for deployment in harsh or temperature-variable environments.
• Environmental Compliance RoHS compliant, supporting lead-free manufacturing and regulatory requirements.

Typical Applications

• Industrial Control Use the industrial temperature rating and 190 I/O to implement sensor interfacing, motor control logic, and deterministic control functions.
• Embedded Processing & Glue Logic Leverage 19,512 logic elements and on-chip RAM for custom data path acceleration, protocol bridging, and peripheral aggregation.
• Communications & Interface Conversion The combination of ample logic resources and a high I/O count supports protocol translators, interface conditioning, and board-level I/O expansion tasks.

Unique Advantages

• Balanced Logic Capacity: 19,512 logic elements and 2,168 CLBs provide a mid-range programmable fabric suitable for complex glue logic and control algorithms without overdesigning the BOM.
• On-Chip Memory: Approximately 0.52 Mbits of embedded RAM reduces reliance on external memory for small buffers and FIFOs, simplifying board design.
• High I/O Count: 190 user I/O pins enable direct connection to a wide set of sensors, peripherals, and interface signals, minimizing external components.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C operation, offering suitability for temperature-challenging environments and extended-use applications.
• Compact Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) footprint supports high-density PCB layouts while maintaining reliable surface-mount assembly.
• Regulatory Compatibility: RoHS compliance supports lead-free manufacturing and adherence to environmental directives.

Why Choose XC3S1200E-4FTG256I?

The XC3S1200E-4FTG256I positions itself as a practical, industrial-grade FPGA choice for engineers who need a balance of configurable logic, embedded memory, and a substantial I/O count in a compact LBGA package. Its specified core voltage range and temperature rating provide predictable electrical and environmental characteristics for robust embedded designs.

This device is well suited to mid-range designs that require on-chip buffering, protocol translation, or control logic implemented in programmable hardware. The combination of logic density, on-chip RAM, and industrial temperature support delivers long-term value for projects that prioritize integration, reliable operation, and compact board-level implementation.

Request a quote or submit an inquiry for pricing and availability to begin integrating the XC3S1200E-4FTG256I into your next design.