XC3S1200E-4FGG400I

The XC3S1200E-4FGG400I is a Spartan®-3E Field Programmable Gate Array (FPGA) offered by AMD, featuring 19,512 logic elements and 2,168 configurable logic blocks. It provides a balanced combination of logic density, on-chip RAM, and a high I/O count for industrial-grade programmable logic applications.

Designed for surface-mount assembly in a compact 400-ball BGA, this device targets designs that require substantial on-chip memory and I/O while operating across a wide industrial temperature range.

Key Features

• Core Logic  19,512 logic elements and 2,168 configurable logic blocks (CLBs) provide substantial programmable logic capacity for custom digital implementations.
• On-chip Memory  Approximately 516,096 bits of embedded memory to support buffering, state storage, and small on-chip data structures.
• I/O Density  304 general-purpose I/O pins enable high pin-count interfaces and multiple parallel connections to external devices.
• Gate Count  1,200,000 gates of logic integration to implement complex finite-state machines and glue logic within a single device.
• Power  Narrow core voltage supply range (1.14 V to 1.26 V) for the FPGA core supply requirements.
• Package & Mounting  400-ball BGA package (supplier device package: 400-FBGA, 21×21) designed for surface-mount PCB assembly and compact board footprints.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly processes.

Typical Applications

• Industrial Control & Automation  Use the device for programmable logic tasks, I/O interfacing, and control functions that require industrial temperature operation and robust I/O counts.
• Communications & Networking  Implement protocol bridging, parallel interface handling, or control-plane logic where on-chip memory and a large number of I/O are beneficial.
• Embedded System Prototyping  Provide a high-density FPGA platform for developing and validating custom logic, finite-state machines, and system glue logic.
• I/O-Intensive Interface Bridging  Serve as a hub for multiple peripheral connections, leveraging 304 I/O pins to connect sensors, controllers, or parallel buses.

Unique Advantages

• Substantial Logic Capacity: 19,512 logic elements and 2,168 CLBs enable implementation of complex custom logic functions within a single device.
• On-Chip Memory for Local Storage: Approximately 516 Kbits of embedded RAM reduce dependence on external memory for buffering and state retention.
• High I/O Count: 304 I/O pins allow dense external interfacing and simplify board-level routing for multi-channel designs.
• Industrial Temperature Rating: Operates from −40 °C to 100 °C, making it suitable for deployments in industrial environments.
• Compact BGA Footprint: 400-FBGA (21×21) package provides a high pin-count solution in a space-efficient form factor for compact PCB designs.
• RoHS Compliant: Conforms to lead-free assembly requirements for regulatory and manufacturing compatibility.

Why Choose XC3S1200E-4FGG400I?

The XC3S1200E-4FGG400I combines a significant pool of programmable logic, on-chip memory, and a high number of I/O in an industrial-grade FPGA package. Its specification set is well suited to engineers seeking a single-device solution for I/O-heavy designs, protocol handling, and embedded control logic that must operate across a wide temperature range.

Backed by AMD as the manufacturer, this device provides predictable electrical and mechanical characteristics—core voltage range, package details, and thermal ratings—that help streamline design decisions and BOM planning for industrial-class applications.

Request a quote or submit a procurement inquiry for the XC3S1200E-4FGG400I to receive pricing and availability information tailored to your project needs.