XC3S1200E-4FGG400C

The XC3S1200E-4FGG400C is a commercial-grade Spartan®-3E field programmable gate array (FPGA) in a 400-ball BGA package. It delivers a balanced mix of logic capacity, on-chip memory and I/O density for embedded and digital system designs that require reconfigurable logic in a compact surface-mount package.

Key attributes include 19,512 logic elements, approximately 0.516 Mbits of embedded memory, up to 304 user I/O pins, and operation across a 1.14 V to 1.26 V core supply range at a commercial temperature grade (0 °C to 85 °C).

Key Features

• FPGA Core Spartan®-3E field programmable gate array architecture for configurable digital logic implementation.
• Logic Capacity 19,512 logic elements providing programmable resources equivalent to approximately 1,200,000 gates for mid-range logic integration.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM (516,096 total RAM bits) to support data buffering, state storage and small lookup tables.
• I/O Density Up to 304 user I/O pins to interface with peripheral devices, sensors and bus structures within constrained board area.
• Power Core supply operating range of 1.14 V to 1.26 V to match system power domains and enable predictable power budgeting.
• Package & Mounting 400-BGA (supplier package: 400-FBGA, 21 × 21) with surface-mount mounting type for compact PCB implementations.
• Grade & Temperature Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Environmental Compliance RoHS compliant to support regulatory requirements for lead-free assemblies.

Unique Advantages

• High programmable logic density: 19,512 logic elements and roughly 1.2 million gates enable consolidating multiple functions into a single FPGA, reducing board-level component count.
• On-chip embedded memory: Approximately 0.516 Mbits of RAM provides local storage for buffering and small-data processing without external memory.
• Robust I/O capacity: 304 user I/O pins allow flexible connectivity to peripherals and interfaces while keeping system routing manageable.
• Compact BGA footprint: 400-ball FBGA (21×21) package enables space-efficient placement on multi-layer PCBs for dense designs.
• Commercial suitability: Specified commercial temperature range and RoHS compliance simplify selection for mainstream electronic products and assemblies.

Why Choose XC3S1200E-4FGG400C?

The XC3S1200E-4FGG400C positions itself as a practical, mid-range Spartan®-3E FPGA option for commercial embedded systems that need a balance of logic resources, embedded memory and I/O in a compact package. Its combination of 19,512 logic elements, approximately 0.516 Mbits of on-chip RAM and 304 I/Os makes it suitable for designs that consolidate multiple digital functions onto a single device.

Choose this part when you need a reconfigurable, RoHS-compliant FPGA with a 400-BGA footprint and a defined commercial operating range. It provides predictable electrical and thermal boundaries for designers and procurement teams focused on scalable, board-level integration.

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