XC3S1400A-4FGG676C

The XC3S1400A-4FGG676C is a Spartan®-3A field programmable gate array (FPGA) IC from AMD, supplied in a 676-ball BGA package. Designed for commercial-grade applications, this device provides a large fabric of programmable logic and I/O resources suitable for embedded and system-level designs that require substantial logic capacity and extensive I/O connectivity.

Key Features

• Logic Capacity — Provides 25,344 logic elements, delivering substantial programmable logic resources for complex combinational and sequential designs.
• Embedded Memory — Includes approximately 0.59 Mbits of on-chip RAM for data buffering, FIFOs and small lookup tables.
• Logic Blocks — Contains 1,400,000 gates of implemented logic, enabling integration of wide-ranging digital functions within a single device.
• I/O Density — Offers 502 user I/O pins, suitable for designs that require many peripheral connections or parallel interfaces.
• Package & Mounting — Supplied in a 676-BGA (676-FBGA, 27 × 27 mm) package for surface-mount assembly, supporting compact board layouts with high pin count.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Operating Range — Commercial temperature grade with specified operating range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Commercial embedded systems — Use the device as the main programmable logic element for control, glue logic, and protocol handling in commercial products operating within 0 °C to 85 °C.
• I/O-intensive systems — Leverage the 502 I/O pins for interfacing to multiple peripherals, sensor arrays or parallel data buses.
• System integration and prototyping — Employ the large logic element count and on-chip RAM to consolidate discrete functions and accelerate prototyping of complex digital systems.

Unique Advantages

• High logic density: 25,344 logic elements enable consolidation of many digital functions into a single FPGA, reducing board complexity.
• Significant on-chip memory: Approximately 0.59 Mbits of embedded RAM supports local buffering and state storage without external memory in many use cases.
• Extensive I/O capability: 502 user I/Os simplify integration with multiple peripherals and parallel interfaces, minimizing the need for external multiplexing.
• BGA package for compact designs: The 676-ball FBGA (27 × 27 mm) package allows high pin-count routing in space-constrained layouts.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliance, aligning with standard commercial production requirements.
• Defined core supply range: Narrow core voltage window (1.14 V–1.26 V) assists in predictable power-supply design and sequencing.

Why Choose XC3S1400A-4FGG676C?

The XC3S1400A-4FGG676C positions itself as a commercially graded FPGA offering substantial logic resources, ample embedded memory, and a high I/O count in a compact 676-BGA package. It is suited for engineers and designers who need to integrate complex digital functions and numerous external interfaces while maintaining a compact board footprint.

With clear electrical and environmental specifications and an available datasheet for design reference, this device provides a verifiable platform for commercial embedded designs that require programmable logic capacity combined with extensive I/O connectivity.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S1400A-4FGG676C and to discuss how it can fit into your next commercial FPGA design.