XC3S1400A-4FGG676I

The XC3S1400A-4FGG676I is a Spartan®-3A Field Programmable Gate Array (FPGA) IC supplied in a 676-ball BGA package. It provides a mid-range programmable logic platform with integrated memory and a large number of I/O pins suited for industrial-grade applications.

With 25,344 logic elements, approximately 0.59 Mbits of embedded memory, and 502 general-purpose I/O, this device targets designs that require flexible, reconfigurable digital logic and substantial I/O connectivity while operating across an industrial temperature range.

Key Features

• Core Logic 25,344 logic elements offering programmable fabric for custom digital functions and control logic.
• On-Chip Memory Approximately 0.59 Mbits of embedded RAM for data buffering, state storage, and small on-chip data structures.
• I/O Capacity 502 I/O pins to support broad connectivity and interface options for peripheral devices and system integration.
• Logic Resources Reported equivalent of 1,400,000 gates to implement complex combinational and sequential logic designs.
• Power Core voltage supply range from 1.14 V to 1.26 V to match platform power rails and support efficient operation.
• Package & Mounting 676-ball FBGA (27 × 27) package in a surface-mount form factor for compact board-level integration.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS compliant to align with environmental and manufacturing requirements.

Typical Applications

• Industrial Control Implement custom control logic and interface aggregation in industrial automation systems while meeting industrial temperature requirements.
• Embedded Systems Act as programmable glue logic, peripheral controllers, or protocol adapters within embedded product designs.
• Prototyping & Development Provide reconfigurable hardware resources for proof-of-concept designs and iterative hardware development.

Unique Advantages

• High logic density: 25,344 logic elements enable implementation of substantial custom logic without external ASICs.
• Meaningful on-chip memory: Approximately 0.59 Mbits of embedded RAM reduces dependency on external memory for many control and buffering tasks.
• Extensive I/O count: 502 I/O pins provide flexibility to connect numerous peripherals and interface standards directly to the FPGA.
• Industrial operating range: Rated from −40 °C to 100 °C for reliable operation in harsher environments.
• Compact package: 676-FBGA (27 × 27) delivers high pin count in a space-efficient surface-mount package for dense board layouts.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing and deployment.

Why Choose XC3S1400A-4FGG676I?

The XC3S1400A-4FGG676I combines a substantial logic resource pool with embedded RAM and a high I/O count in a compact 676-BGA package, making it well-suited for industrial and embedded applications that require reconfigurable digital logic and broad connectivity. Its industrial temperature rating and RoHS compliance support durable, manufacturable designs.

This device is a practical option for design teams seeking a mid-range FPGA solution that balances logic capacity, on-chip memory, and I/O integration while providing the robustness expected in industrial deployments.

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