XC3S1400A-4FTG256I

The XC3S1400A-4FTG256I is a Spartan®-3A family FPGA delivered in a 256-LBGA package for surface-mount applications. It combines 25,344 logic elements, approximately 0.59 Mbits of embedded memory, and 161 user I/O to support custom digital logic, I/O interfacing, and system integration tasks.

Designed for industrial-grade applications, the device operates from a 1.14 V to 1.26 V core supply and across an extended temperature range of -40 °C to 100 °C, enabling deployment in environments that require robust, reprogrammable logic capacity.

Key Features

• Core Logic 25,344 logic elements provide substantial programmable logic density for implementing user-defined digital functions and state machines.
• On-Chip Memory Approximately 0.59 Mbits of embedded RAM for buffering, lookup tables, and temporary storage directly within the FPGA fabric.
• I/O and Gate Count 161 user I/O pins and a gate equivalence of 1,400,000 gates to support complex interfacing and high-integration designs.
• Power Core voltage supply specified at 1.14 V to 1.26 V to match system power rails and help define predictable power budgets.
• Package and Mounting Supplied in a 256-LBGA (supplier package: 256-FTBGA, 17×17) for compact surface-mount implementations.
• Environmental and Grade Industrial-grade device with operating temperature from -40 °C to 100 °C and RoHS compliance for regulated manufacturing environments.

Typical Applications

• Embedded System Control — Implement custom control logic and state machines for industrial controllers and automation equipment.
• Interface Bridging — Bridge and adapt between disparate digital interfaces using programmable I/O and internal logic resources.
• Data Buffering and Pre‑processing — Use on-chip RAM and logic to buffer or preprocess data streams before passing to downstream subsystems.

Unique Advantages

• Significant Logic Capacity: 25,344 logic elements enable integration of multiple functions on a single device, reducing BOM and board complexity.
• On-Chip Memory: Approximately 0.59 Mbits of embedded RAM supports local buffering and lookup tables without external memory.
• Robust I/O Count: 161 user I/O pins provide flexibility for complex interfacing and multiple peripheral connections.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for deployment in temperature-demanding environments.
• Compact Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) enables high-density PCB layouts while supporting surface-mount assembly processes.
• Regulatory Compliance: RoHS-compliant construction to meet common environmental manufacturing requirements.

Why Choose XC3S1400A-4FTG256I?

The XC3S1400A-4FTG256I delivers a balance of programmable logic density, embedded memory, and I/O capacity in an industrial-grade FPGA package. Its specification set is suited to designs that need substantial on-chip resources and reliable operation across a wide temperature range.

This device is appropriate for engineering teams building custom digital logic, interface adapters, or embedded controllers that benefit from reprogrammability, on-chip memory, and a compact BGA footprint for surface-mount assembly.

Request a quote or submit a procurement inquiry to secure pricing, lead times, and availability for the XC3S1400A-4FTG256I.