XC3S1400AN-4FG484I

The XC3S1400AN-4FG484I is a Spartan®-3AN Field Programmable Gate Array (FPGA) IC from AMD delivered in a 484-BBGA surface-mount package. It provides substantial programmable logic capacity, embedded memory, and I/O resources in an industrial-grade component.

Key on-chip resources include 25,344 logic elements, approximately 0.59 Mbits of embedded memory, and 372 I/O pins, with a core supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Programmable Logic Capacity — 25,344 logic elements and approximately 1,400,000 gates to implement complex digital functions.
• Embedded Memory — Approximately 0.59 Mbits (589,824 bits) of on-chip RAM for data buffering and local storage.
• I/O Resources — 372 general-purpose I/O pins to support multiple interfaces and peripheral connections.
• Integration Density — Listed with 2,816 logic units enabling significant logic partitioning within the device.
• Package and Mounting — 484-BBGA, surface-mount package; supplier device package specified as 484-FBGA (23×23).
• Power — Core supply voltage range from 1.14 V to 1.26 V for the programmable fabric.
• Temperature Range — Industrial operating range from −40 °C to 100 °C for use in wide-temperature environments.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• High logic density: 25,344 logic elements enable implementation of complex digital designs on a single device.
• Substantial on-chip memory: Approximately 0.59 Mbits of embedded RAM provides local data storage for buffering and state retention.
• Extensive I/O availability: 372 I/Os support multiple peripheral and interface requirements without immediate need for external expanders.
• Industrial temperature support: −40 °C to 100 °C operation accommodates demanding environmental conditions.
• Compact BGA footprint: 484-BBGA (484-FBGA, 23×23) surface-mount package supports high-density board layouts.
• Manufacturer pedigree: Produced by AMD as part of the Spartan®-3AN family, offering a defined set of programmable resources and package options.

Why Choose XC3S1400AN-4FG484I?

The XC3S1400AN-4FG484I combines a large programmable logic fabric, significant embedded RAM, and ample I/O in a compact 484-BBGA surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for designs that require robustness across a wide thermal range while meeting environmental regulations.

This FPGA is appropriate for projects that need a balance of logic density, on-chip memory, and I/O capacity within a space-constrained board footprint, delivered by a known FPGA family from AMD.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S1400AN-4FG484I.