XC3S1400AN-4FGG676I

The XC3S1400AN-4FGG676I is a Spartan®-3AN field programmable gate array (FPGA) from AMD, delivered in a 676-ball BGA package. It provides a high-density programmable fabric with 25,344 logic elements, approximately 0.59 Mbits of embedded RAM, and 502 user I/O pins for systems requiring significant on-chip resources and flexible I/O.

Built to operate over an industrial temperature range and a narrow core voltage window, this device targets applications that need reliable programmable logic with substantial gate count and embedded memory in a compact surface-mount form factor.

Key Features

• Core Logic  25,344 logic elements and approximately 1,400,000 gates provide substantial programmable logic capacity for complex control, signal processing, and glue-logic integration.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM to support buffering, state storage, and small on-chip data structures without external memory.
• I/O Density  502 user I/O pins enable broad connectivity to peripherals, sensors, and external devices within a single FPGA package.
• Power Supply  Core voltage range of 1.14 V to 1.26 V supports the device’s specified operating conditions and power domain planning.
• Package and Mounting  Available in a 676-BGA (supplier package 676-FBGA, 27 × 27) surface-mount package for compact board layouts and high pin count routing.
• Industrial Temperature Range  Rated to operate from −40 °C to 100 °C, meeting temperature needs for industrial applications.
• Environmental Compliance  RoHS compliant for regulatory and environmental requirements.

Typical Applications

• Industrial Control  Use the device’s industrial temperature rating and extensive I/O to implement motor drives, PLC interfaces, and factory automation logic.
• Embedded Processing and Glue Logic  High logic element count and on-chip RAM support implementation of custom controllers, protocol bridges, and peripheral aggregation.
• High-Density I/O Systems  With 502 I/O pins in a 676-BGA package, the FPGA can consolidate multiple interfaces and sensor connections on a compact PCB footprint.

Unique Advantages

• High Logic Capacity: 25,344 logic elements and ~1.4M gates enable complex designs without partitioning across multiple devices, reducing system complexity.
• On-Chip Memory: Approximately 0.59 Mbits of embedded RAM reduces dependence on external memory for buffering and small data structures.
• Extensive I/O: 502 user I/Os provide flexibility to interface with a wide range of peripherals and local buses from a single device.
• Industrial Robustness: Rated for −40 °C to 100 °C operation, suitable for demanding environments where temperature resilience is required.
• Compact, High-Pin Package: 676-BGA (27 × 27) surface-mount package balances a high pin count with a small PCB footprint for space-constrained designs.
• Regulatory Compliance: RoHS-compliant construction supports environmentally conscious manufacturing and regulatory requirements.

Why Choose XC3S1400AN-4FGG676I?

The XC3S1400AN-4FGG676I combines substantial programmable logic resources, embedded memory, and a large I/O complement in a single industrial-grade FPGA. Its 676-BGA surface-mount package and core voltage range are well-suited to compact, high-density boards that must operate across a wide temperature span.

This device is appropriate for design teams and procurement professionals seeking a verified FPGA option from AMD that delivers measurable logic density, on-chip RAM, and robust I/O for industrial and embedded applications where integration and reliability are priorities.

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