XC3S1400AN-5FG484C

The XC3S1400AN-5FG484C is a Spartan®-3AN field programmable gate array (FPGA) manufactured by AMD. It provides a programmable logic fabric with a large logic element count, embedded RAM, and substantial I/O in a compact BGA package.

Designed for commercial-grade electronic designs, this surface-mount FPGA is suited to applications that require dense programmable logic, embedded memory, and high pin counts within a 484-BBGA footprint.

Key Features

• Core Logic  2,816 CLBs and 25,344 logic elements delivering approximately 1,400,000 gates of programmable logic capacity for implementing custom digital functions.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 bits) for data buffering, state storage, and local processing.
• I/O Density  Up to 372 user I/O pins to support multiple external interfaces and board-level connectivity.
• Package and Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) in a surface-mount form factor for compact PCB integration.
• Power  Core supply range 1.14 V to 1.26 V for defined power budgeting and system power design.
• Operating Range and Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Programmable logic integration  Implement custom digital functions and glue-logic using the FPGA’s 25,344 logic elements and CLB fabric.
• High-density I/O systems  Designs requiring many external interfaces can leverage up to 372 I/O pins for signal routing and peripheral connectivity.
• Embedded commercial systems  Compact, surface-mount 484-BBGA packaging and on-chip RAM make the device suitable for commercial embedded designs operating within 0 °C to 85 °C.

Unique Advantages

• Substantial logic capacity: 25,344 logic elements and 2,816 CLBs provide extensive resources for complex logic implementations.
• On-chip memory availability: Approximately 0.59 Mbits of embedded RAM reduces dependence on external memory for many designs.
• High I/O count: 372 I/O pins enable dense interfacing without additional I/O expanders.
• Compact BGA footprint: 484-BBGA (23×23) package supports high-density board layouts while remaining surface-mount friendly.
• Defined power envelope: Core voltage range of 1.14 V to 1.26 V supports predictable power planning.
• RoHS compliant commercial device: Meets common environmental requirements for commercial electronic products.

Why Choose XC3S1400AN-5FG484C?

The XC3S1400AN-5FG484C positions itself as a commercially graded FPGA that balances substantial programmable logic capacity, on-chip memory, and a high I/O count in a compact 484-BBGA surface-mount package. Its defined core voltage range and RoHS compliance help streamline system design and regulatory considerations.

This device is well suited for engineers and procurement teams seeking a mid-to-high density FPGA solution from AMD for commercial embedded and digital designs that require integrated memory, extensive logic resources, and broad I/O in a compact package.

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