XC3S1500-4FGG320C

The XC3S1500-4FGG320C is a Spartan®-3 Field Programmable Gate Array (FPGA) in a 320-BGA package designed for commercial-grade applications. It integrates 29,952 logic elements, approximately 0.59 Mbits of embedded memory, and 221 user I/O pins to support medium-complexity programmable logic designs.

With an on-chip gate count of 1,500,000 and a nominal core supply range of 1.14 V to 1.26 V, this surface-mount device provides a balanced combination of logic density, embedded memory, and I/O capacity in a compact 320-FBGA (19×19) package.

Key Features

• Logic Capacity — 29,952 logic elements providing substantial programmable logic resources for a wide range of digital designs.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM to store data, buffers, or state information without external memory for many use cases.
• I/O Resources — 221 user I/O pins to support multiple interfaces and system connections on a single device.
• Gate Count — 1,500,000 gates offering the raw combinational and sequential resources required by complex logic functions.
• Power and Voltage — Core supply range from 1.14 V to 1.26 V for compatibility with systems designed around this nominal voltage.
• Package and Mounting — 320-BGA (supplier package: 320-FBGA, 19×19) in a surface-mount form factor for compact board-level integration.
• Operating Range and Grade — Commercial grade with operating temperature from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing alignment.

Unique Advantages

• Ample Logic Resources: Nearly 30k logic elements and 1.5M gates allow integration of complex logic blocks without immediate need for multiple devices.
• On‑Chip Memory Availability: Approximately 0.59 Mbits of embedded RAM reduce reliance on external memory for buffering and small data stores.
• High I/O Count: 221 I/O pins enable multiple peripheral and interface connections from a single FPGA package, simplifying board routing and BOM.
• Compact Ball Grid Array Package: 320-FBGA (19×19) provides a high-density mounting option for space-constrained PCBs while supporting robust signal routing.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to meet standard commercial application environments.
• Regulatory Alignment: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XC3S1500-4FGG320C?

The XC3S1500-4FGG320C positions itself as a versatile commercial-grade FPGA that balances logic density, embedded memory, and I/O capacity within a compact 320-BGA package. Its combination of nearly 30k logic elements, substantial gate count, and on-chip RAM makes it suitable for designs that require integrated programmable logic and moderate on-chip storage.

This part is well suited to engineers and procurement teams looking for a surface-mount FPGA solution with clear electrical and environmental specifications (1.14 V–1.26 V core supply, 0 °C–85 °C operating range, RoHS compliant), enabling predictable integration into commercial electronic systems.

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