XC3S1500-4FGG320I

The XC3S1500-4FGG320I is a Spartan®-3 field programmable gate array (FPGA) from AMD designed for programmable logic applications. It provides a substantial logic resource set and on-chip memory in a compact 320‑ball BGA package for surface-mount assembly.

With 29,952 logic elements, approximately 0.59 Mbits of embedded memory and 221 I/O, this device targets designs that require significant programmable logic, plentiful connectivity and operation across industrial temperature ranges.

Key Features

• Core Logic 29,952 logic elements and 3,328 logic blocks provide extensive programmable logic capacity, supporting complex custom digital designs. The device is characterized as approximately 1,500,000 gates.
• Embedded Memory Approximately 0.59 Mbits of on-chip RAM to support buffering, state storage and intermediate data handling without external memory in many designs.
• I/O and Integration 221 user I/O pins enable broad connectivity for sensors, actuators, peripherals and external interfaces directly from the FPGA fabric.
• Power Core supply range specified at 1.14 V to 1.26 V for the device core power domain.
• Package & Mounting 320‑BGA package (supplier device package: 320‑FBGA, 19×19) optimized for surface-mount PCB assembly and compact board footprints.
• Thermal & Grade Industrial grade device rated for operation from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control — Leverages the industrial temperature range and abundant I/O to implement custom control logic, sensor interfacing and actuator drive functions.
• Embedded Systems — Uses the large logic element count and on-chip RAM for application-specific processing, glue logic and real-time control tasks.
• Prototyping and Custom IP — Provides a programmable platform for validating custom digital designs and integrating proprietary IP with substantial gate and logic resources.
• Interface Bridging and Buffering — Employs the combination of I/O density and embedded memory to implement protocol translators, data buffers and intermediate processing stages.

Unique Advantages

• High logic capacity: 29,952 logic elements enable implementation of complex custom logic directly in the FPGA fabric, reducing external component count.
• Significant on‑chip RAM: Approximately 0.59 Mbits of embedded memory supports local buffering and state retention without immediate reliance on external memory.
• Extensive I/O: 221 user I/O pins facilitate integration with a wide range of peripherals and sensors, simplifying board-level design.
• Industrial temperature rating: Operation from -40 °C to 100 °C makes the device suitable for deployment in demanding environmental conditions.
• Compact BGA footprint: The 320‑BGA (320‑FBGA, 19×19) package allows dense placement on PCBs while maintaining a high pin count.
• RoHS compliant: Meets environmental directives for restricted substances.

Why Choose XC3S1500-4FGG320I?

The XC3S1500-4FGG320I balances substantial programmable logic capacity, on-chip memory and a high I/O count in a compact 320‑BGA package, positioning it for industrial and embedded designs that require flexible, field-programmable hardware. Its industrial temperature rating and RoHS compliance provide deployment reliability in temperature-challenging environments while aligning with environmental requirements.

This device is well suited to engineers and procurement teams designing custom digital logic, interface bridging, or embedded control systems where integration, predictable power characteristics and robust operating temperature range are key considerations.

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