XC3S1000-4FT256C

IC FPGA 173 I/O 256FTBGA
Part Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 173 442368 17280 256-LBGA

Quantity 1,701 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O173Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells17280
Number of Gates1000000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of XC3S1000-4FT256C – Spartan®-3 FPGA, 1,000,000 gates, 17,280 logic elements, 256-LBGA

The XC3S1000-4FT256C is a Spartan®-3 field programmable gate array (FPGA) IC from AMD, offered in a compact 256-LBGA package. It provides a balance of programmable logic capacity, embedded memory, and I/O count for commercial embedded designs that require reconfigurable hardware integration.

Key attributes include 17,280 logic elements, approximately 0.44 Mbits of on-chip RAM, 173 user I/Os, and a single-supply operating voltage range—features that support a wide range of general-purpose programmable logic applications within commercial temperature limits.

Key Features

  • Logic Capacity  17,280 logic elements provide the programmable logic resources for implementing custom digital functions and control logic.
  • Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 total RAM bits) for data buffering, FIFOs, and local storage.
  • I/O Resources  173 available I/O pins to interface with external devices, peripherals, and system buses.
  • Gate Count  Rated at 1,000,000 gates to indicate overall fabric scale for design partitioning.
  • Power Supply  Operates from a supply range of 1.14 V to 1.26 V to match platform power rails.
  • Package & Mounting  256-LBGA package (supplier device package: 256-FTBGA, 17×17) in a surface-mount form factor for compact PCB layouts.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C, suitable for standard commercial environments.
  • RoHS Compliance  Device is RoHS compliant.

Unique Advantages

  • High programmable density: 17,280 logic elements and 1,000,000 gates provide substantial capacity for mid-range FPGA designs without overspecing.
  • Integrated memory resources: Approximately 0.44 Mbits of embedded RAM reduces external memory needs for buffering and local storage.
  • Versatile I/O count: 173 I/Os enable direct interfacing to a broad set of peripherals and support flexible board-level connectivity.
  • Compact, surface-mount package: 256-LBGA (256-FTBGA, 17×17) supports dense PCB integration while maintaining a standardized footprint.
  • Commercial-ready specification: Commercial temperature rating and RoHS compliance simplify procurement and deployment in standard commercial products.
  • Controlled supply range: A defined supply voltage window (1.14 V to 1.26 V) aids predictable power budgeting and system design.

Why Choose XC3S1000-4FT256C?

The XC3S1000-4FT256C offers a practical mix of logic resources, embedded memory, and I/O capacity in a compact 256-LBGA surface-mount package. As a commercial-grade Spartan®-3 FPGA from AMD with RoHS compliance, it is suited for design teams and procurement professionals seeking a verified programmable logic device with clear electrical and thermal limits.

This device is a fit for projects that require mid-range programmable capacity, integrated RAM for local data handling, and ample I/O — all within a package footprint that supports dense PCB layouts. The defined voltage and temperature specifications help streamline integration and system-level planning.

Request a quote or submit a quote inquiry to obtain pricing, availability, and ordering information for the XC3S1000-4FT256C.

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