XC3S1000-4FGG456C

The XC3S1000-4FGG456C is an AMD Spartan®-3 Field Programmable Gate Array (FPGA) IC provided in a 456-BBGA surface-mount package. It delivers a commercial-grade, reconfigurable logic platform with a balance of logic capacity, on-chip memory and I/O density suitable for a range of embedded designs.

Key hardware characteristics include 1,920 CLBs (17,280 logic elements), 442,368 total RAM bits (approximately 0.44 Mbits), 333 user I/O pins, and an operating supply range of 1.14 V to 1.26 V. The device is rated for 0 °C to 85 °C operation and is RoHS compliant.

Key Features

• Core Logic 1,920 CLBs delivering 17,280 logic elements and 1,000,000 gates to implement custom digital logic and control functions.
• Embedded Memory 442,368 total RAM bits (approximately 0.44 Mbits) of on-chip memory to support buffering, LUT-based storage and state machines.
• Rich I/O 333 user I/O pins to interface with peripherals, sensors and external devices while supporting flexible board-level connectivity.
• Package & Mounting 456-BBGA package (supplier device package: 456-FBGA, 23×23) with surface-mount mounting for compact PCB integration.
• Power Tight supply operating range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Operating Range & Grade Commercial grade device rated for 0 °C to 85 °C operation, suitable for standard commercial electronics environments.
• Regulatory RoHS compliant.

Typical Applications

• Commercial Embedded Systems Implement custom control, signal processing and interface logic using the device's 17,280 logic elements and 333 I/O pins.
• Prototyping and Development Use the reconfigurable Spartan®-3 platform to validate digital designs and iterate quickly with on-chip memory and abundant logic resources.
• Board-Level Integration The 456-BBGA surface-mount package and defined supply range make the device suited for compact PCB designs requiring moderate logic density.

Unique Advantages

• Balanced Logic Density: 17,280 logic elements and 1,000,000 gates provide sufficient capacity for medium-complexity digital designs without excessive footprint.
• Integrated Memory Resources: Approximately 0.44 Mbits of on-chip RAM reduces external memory requirements for buffering and state storage.
• High I/O Count: 333 user I/O pins enable multiple peripheral interfaces and flexible system connectivity.
• Compact, Surface-Mount Package: 456-BBGA (456-FBGA, 23×23) supports compact board layouts and high-density assemblies.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant, aligning with standard commercial product requirements.

Why Choose XC3S1000-4FGG456C?

The XC3S1000-4FGG456C positions itself as a commercial-grade Spartan®-3 FPGA offering a practical mix of logic capacity, embedded memory and I/O for designers who need reconfigurable hardware within a compact, surface-mount package. Its defined supply voltage range and temperature rating make it straightforward to integrate into typical commercial electronic systems.

This device is appropriate for engineers and procurement teams seeking a validated FPGA platform with measurable on-chip resources (logic elements, RAM bits, I/O count) and a standard BGA package. The combination of resources supports scalable development, prototyping and deployment within commercial product lines.

Request a quote or submit a pricing inquiry for the XC3S1000-4FGG456C to obtain current availability and lead-time information.