XC3S1000-4FGG320C

The XC3S1000-4FGG320C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD, offered in a compact 320-ball BGA package. It provides a balance of configurable logic, embedded memory, and I/O capacity for commercial-grade designs that require programmable digital logic.

With 1,920 configurable logic blocks (CLBs) yielding 17,280 logic elements and approximately 0.44 Mbits of on-chip RAM, the device supports a range of user-defined digital functions while operating within a 1.14 V to 1.26 V supply window and a 0 °C to 85 °C temperature range.

Key Features

• Core Logic  1,920 CLBs (configurable logic blocks) delivering 17,280 logic elements for user-programmable digital designs.
• Embedded Memory  Total on-chip RAM of 442,368 bits—approximately 0.44 Mbits—suitable for lookup tables, FIFOs, and small data buffers.
• I/O Capacity  221 user I/O pins to support a variety of external interfaces and peripheral connections.
• Gate Count  Approximately 1,000,000 gates to indicate device complexity and integration potential.
• Power  Low-voltage core operation with a supply range of 1.14 V to 1.26 V for the FPGA core.
• Package & Mounting  320-ball BGA (supplier package: 320-FBGA, 19×19) in a surface-mount form factor for compact, board-level integration.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for standard commercial applications.
• RoHS Compliance  Device is RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Embedded and custom digital systems  Programmable logic for custom control, glue logic, and hardware-accelerated functions in commercial products.
• Prototyping and development  Flexible platform for validating digital designs and iterating hardware functionality.
• Interface and I/O control  Utilize the 221 I/O pins to implement custom interface bridging and peripheral management.

Unique Advantages

• Flexible logic density: 1,920 CLBs and 17,280 logic elements provide a scalable foundation for mid-range programmable logic tasks.
• On-chip memory available: Approximately 0.44 Mbits of embedded RAM reduces reliance on external memory for small buffers and state storage.
• High I/O count: 221 I/O pins enable direct connections to a wide set of peripherals, simplifying board design.
• Compact BGA footprint: 320-ball FBGA (19×19) enables high-density PCB layouts while supporting surface-mount assembly.
• Commercial readiness: Rated for 0 °C to 85 °C and RoHS compliant, aligning with standard commercial manufacturing practices.

Why Choose XC3S1000-4FGG320C?

The XC3S1000-4FGG320C positions itself as a commercial-grade Spartan®-3 FPGA option that combines configurable logic resources, embedded RAM, and substantial I/O in a compact 320-BGA package. Its gate count and logic element capacity make it suitable for designers who need programmable hardware to implement custom digital functions without moving to larger device classes.

This device is appropriate for teams seeking a balance of integration and board-level density, offering predictable operating voltage and temperature bounds, surface-mount packaging, and RoHS compliance for modern electronic assemblies.

Request a quote or submit a pricing inquiry today to evaluate the XC3S1000-4FGG320C for your next programmable logic design.