XC3S1000-4FG456C

The XC3S1000-4FG456C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD designed to implement configurable digital logic. The device provides 17,280 logic elements, approximately 0.42 Mbits of embedded RAM, and up to 333 general-purpose I/O pins.

Packaged in a 456-ball BGA (456-FBGA, 23 × 23) surface-mount package and specified for commercial operation (0 °C to 85 °C), this FPGA targets designs that require significant logic capacity and a high I/O count within a compact footprint.

Key Features

• Logic Capacity — 17,280 logic elements to implement medium-scale custom digital functions and state machines.
• On-chip Memory — 442,368 total RAM bits (approximately 0.42 Mbits) for local buffering, FIFOs, and working memory.
• I/O Resources — 333 available I/O pins to support multiple external interfaces and parallel connections.
• Gate Equivalent — 1,000,000 equivalent gates to describe overall device complexity and integration potential.
• Power — Core voltage supply range of 1.14 V to 1.26 V, enabling standard low-voltage core operation.
• Package & Mounting — 456-ball BGA (456-FBGA, 23 × 23) package with surface-mount mounting for compact board integration.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation and supplied in a commercial grade.

Typical Applications

• I/O-intensive interface modules — Use the high I/O count to aggregate and route multiple external signals or peripheral buses.
• Embedded control and glue logic — Implement custom control, state machines, and protocol adaptation using the device's logic elements and on-chip RAM.
• Data buffering and temporary storage — Leverage approximately 0.42 Mbits of embedded RAM for FIFOs, line buffering, or small data caches.

Unique Advantages

• High logic density: 17,280 logic elements provide the resources to consolidate multiple discrete functions into a single device, reducing board complexity.
• Substantial embedded memory: Approximately 0.42 Mbits of on-chip RAM supports local buffering and data-handling tasks without external memory.
• Extensive I/O availability: 333 I/O pins accommodate complex interface requirements and expand system connectivity options.
• Compact BGA package: The 456-ball BGA (23 × 23) surface-mount package helps save PCB area while supporting high pin density.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for designs targeted at commercial environments.
• AMD manufacturing: Backed by AMD as the manufacturer, providing consistent device identification and documentation.

Why Choose XC3S1000-4FG456C?

The XC3S1000-4FG456C balances significant logic resources, on-chip RAM, and a high I/O count in a compact 456-BBGA surface-mount package. It is well suited to designs that require medium-scale programmable logic, multiple external interfaces, and local data buffering within a commercial temperature envelope.

For engineers and procurement teams targeting solutions that consolidate discrete logic, implement custom interfaces, or add adaptable control functionality, this AMD Spartan®-3 FPGA offers a clear specification set—making it a practical choice for projects that match its logic, memory, I/O, power, and packaging characteristics.

Request a quote or submit a procurement inquiry to receive pricing and availability details for the XC3S1000-4FG456C.